參數(shù)資料
型號(hào): WEDPS512K32-35BI
廠商: MICROSEMI CORP-PMG MICROELECTRONICS
元件分類: SRAM
英文描述: 512K X 32 MULTI DEVICE SRAM MODULE, 35 ns, PBGA143
封裝: 16 X 18 MM, PLASTIC, BGA-143
文件頁(yè)數(shù): 4/6頁(yè)
文件大?。?/td> 202K
代理商: WEDPS512K32-35BI
4
White Electronic Designs Corporation Phoenix AZ (602) 437-1520
WEDPS512K32-XBX
WS32K32-XHX
FIG. 5 TIMING WAVEFORM - READ CYCLE
FIG. 6 WRITE CYCLE - WE CONTROLLED
FIG. 6 WRITE CYCLE - CS CONTROLLED
相關(guān)PDF資料
PDF描述
WEDPS512K32-35BC 512K X 32 MULTI DEVICE SRAM MODULE, 35 ns, PBGA143
WEDPS512K32V-20BI 512K X 32 MULTI DEVICE SRAM MODULE, 20 ns, PBGA143
WEM1010-1003 50 MHz - 300 MHz RF/MICROWAVE SPLITTER, 1.5 dB INSERTION LOSS
WF-128K32-150HI 512K X 8 FLASH 12V PROM MODULE, 150 ns, CPGA66
WF-128K32-150HM 512K X 8 FLASH 12V PROM MODULE, 150 ns, CPGA66
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
WEDPS512K32LV-12BC 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE
WEDPS512K32LV-12BI 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE
WEDPS512K32LV-12BM 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE
WEDPS512K32LV-15BC 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE
WEDPS512K32LV-15BI 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE