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參數(shù)資料
| 型號： | WEDPS512K32-17BI |
| 廠商： | MICROSEMI CORP-PMG MICROELECTRONICS |
| 元件分類： | SRAM |
| 英文描述： | 512K X 32 MULTI DEVICE SRAM MODULE, 17 ns, PBGA143 |
| 封裝： | 16 X 18 MM, PLASTIC, BGA-143 |
| 文件頁數(shù)： | 7/7頁 |
| 文件大?。?/td> | 235K |
| 代理商： | WEDPS512K32-17BI |
WEDPS512K32-XBX
7
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
White Electronic Designs Corp. reserves the right to change products or specications without notice.
November, 2003
Rev.6
Document Title
512K x 32 SRAM Multi-Chip Package
Revision History
Rev #
History
ReleaseDate
Status
Rev 0
Initial Release
March 2002
Advanced
Rev 1
Switch Rows and Columns header position (Pg. 1)
March 2002
Advanced
Rev 2
Switch Rows and Columns header position (Pg. 1)
May 2002
Advanced
Rev 3
Change mechanical outline to more accurate design (Pg. 1, 5)
May 2002
Advanced
Rev 4
Remove references to 25-55ns speed grades (Pg. 1, 2, 3)
August 2002
Advanced
Rev 5
Changes (Pg. 1, 2)
1.1 Add Thermal Resistance Table
1.2 Change product status to Final
January 2003
Final
Rev 6
Changes (Pg. 1, 5, 7)
1.1 Change package body height to 1.93mm Max
1.2 Add ball pitch (1.27mm) to package dimension
November 2003
Final
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| WF128K64-120G4WM5 | 1M X 8 FLASH 5V PROM MODULE, 120 ns, CQMA116 |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| WEDPS512K32-17BM | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512Kx32 SRAM MULTI-CHIP PACKAGE |
| WEDPS512K32-20BC | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512Kx32 SRAM MULTI-CHIP PACKAGE |
| WEDPS512K32-20BI | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512Kx32 SRAM MULTI-CHIP PACKAGE |
| WEDPS512K32-20BM | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512Kx32 SRAM MULTI-CHIP PACKAGE |
| WEDPS512K32LV-12BC | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE |
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