型號(hào): | WEDPS512K32-17BI |
廠(chǎng)商: | MICROSEMI CORP-PMG MICROELECTRONICS |
元件分類(lèi): | SRAM |
英文描述: | 512K X 32 MULTI DEVICE SRAM MODULE, 17 ns, PBGA143 |
封裝: | 16 X 18 MM, PLASTIC, BGA-143 |
文件頁(yè)數(shù): | 3/7頁(yè) |
文件大?。?/td> | 235K |
代理商: | WEDPS512K32-17BI |
相關(guān)PDF資料 |
PDF描述 |
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WF128K32-70G4TQ5A | 128K X 32 FLASH 5V PROM MODULE, 70 ns, CQFP68 |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
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WEDPS512K32-17BM | 制造商:WEDC 制造商全稱(chēng):White Electronic Designs Corporation 功能描述:512Kx32 SRAM MULTI-CHIP PACKAGE |
WEDPS512K32-20BC | 制造商:WEDC 制造商全稱(chēng):White Electronic Designs Corporation 功能描述:512Kx32 SRAM MULTI-CHIP PACKAGE |
WEDPS512K32-20BI | 制造商:WEDC 制造商全稱(chēng):White Electronic Designs Corporation 功能描述:512Kx32 SRAM MULTI-CHIP PACKAGE |
WEDPS512K32-20BM | 制造商:WEDC 制造商全稱(chēng):White Electronic Designs Corporation 功能描述:512Kx32 SRAM MULTI-CHIP PACKAGE |
WEDPS512K32LV-12BC | 制造商:WEDC 制造商全稱(chēng):White Electronic Designs Corporation 功能描述:512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE |