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參數(shù)資料
| 型號： | WED8L24258V12BC |
| 廠商： | WHITE ELECTRONIC DESIGNS CORP |
| 元件分類： | SRAM |
| 英文描述： | 256K X 24 STANDARD SRAM, 12 ns, PBGA119 |
| 封裝： | 14 X 22 MM, MO-163, BGA-119 |
| 文件頁數(shù)： | 1/5頁 |
| 文件大?。?/td> | 442K |
| 代理商： | WED8L24258V12BC |
1
White Electronic Designs Corporation (508) 366-5151 www.whiteedc.com
July 2002 Rev. 0A
ECO #15432
WED8L24258V
FIG. 1
PIN NAMES
BLOCK DIAGRAM
PIN SYMBOLS
PIN CONFIGURATION
Asynchronous SRAM, 3.3V, 256Kx24
FEATURES
n 256Kx24 bit CMOS Static
n Random Access Memory Array
Fast Access Times: 10, 12, and 15ns
Master Output Enable and Write Control
Three Chip Enables for Byte Control
TTL Compatible Inputs and Outputs
Fully Static, No Clocks
n Surface Mount Package
119 Lead BGA (JEDEC MO-163), No. 391
Small Footprint, 14mmx22mm
Multiple Ground Pins for Maximum Noise Immunity
n Single +3.3V (±5%) Supply Operation
n DSP Memory Solution
Motorola DSP5630x
Analog Devices SHARCTM
DESCRIPTION
The WED8L24258VxxBC is a 3.3V, twelve megabit SRAM con-
structed with three 256Kx8 die mounted on a multi-layer laminate
substrate. With 10 to 15ns access times, x24 width and a 3.3V
operatingvoltage,theWED8L24258Visidealforcreatingasinglechip
memory solution for the Motorola DSP5630x or a two chip solution
for the Analog Devices SHARCTM DSP.
The single or dual chip memory solutions offer improved system
performance by reducing the length of board traces and the number
of board connections compared to using multiple monolithic devices.
The JEDEC Standard 119 lead BGA provides a 69% space savings
over using six 256Kx4, 300 mil wide SOJs and the BGA package
has a maximum height of 110 mils compared to 148 mils for the SOJ
packages. The BGA package also allows the use of the same
manufacturingandinspectiontechniquesastheMotorolaDSP,which
is also in a BGA package.
1
234
56
7
A
NC
AO
A1A2
A3A4
NC
B
NC
A5A6E0
A7A8
NC
C
I/012
NC
E2
NC
E3
NC
I/00
D
I/013
VCC
GND
VCC
I/01
E
I/014
GND
VCC
GND
VCC
GND
I/02
F
I/015
VCC
GND
VCC
I/03
G
I/016
GND
VCC
GND
VCC
GND
I/04
H
I/017
VCC
GND
VCC
I/05
J
NC
GND
VCC
GND
VCC
GND
NC
K
I/018
VCC
GND
VCC
I/06
L
I/019
GND
VCC
GND
VCC
GND
I/07
M
I/020
VCC
GND
VCC
I/08
N
I/021
GND
VCC
GND
VCC
GND
I/09
P
I/022
VCC
GND
VCC
I/010
R
I/023
NC
A17
I/011
T
NC
A9
A10
W
A11
A12
NC
UNC
A13
A14
G
A15
A16
NC
A0-17
Address Inputs
E
Chip Enable
W
Master Write Enable
G
Master Output Enable
DQ0-23
Common Data Input/Output
VCC
Power (3.3V ±5%)
GND
Ground
NC
No Connection
256K x 24
Memory
Array
18
A0-A17
G
W
E0
E2
E3
DQ0-7
DQ8-15
DQ16-23
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| WED8L24258V12BI | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x24 SRAM Module |
| WED8L24258V15BC | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x24 SRAM Module |
| WED8L24258V15BI | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x24 SRAM Module |
| WED8L24513V | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:Asynchronous SRAM, 3.3V, 512Kx24 |
| WED8L24513V10BC | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:Asynchronous SRAM, 3.3V, 512Kx24 |
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