參數(shù)資料
型號(hào): W99802G
廠商: WINBOND ELECTRONICS CORP
元件分類: 通信及網(wǎng)絡(luò)
英文描述: SPECIALTY TELECOM CIRCUIT, PBGA184
封裝: 10 X 10 MM, 1.60 MM HEIGHT, LEAD FREE, LFBGA-184
文件頁(yè)數(shù): 22/31頁(yè)
文件大小: 371K
代理商: W99802G
W99802G
Publication Release Date: Mar. 3, 2006
- 29 -
Revision A0
6. PACKAGE DIMENSION
W99802G Package Outline (184L STK LFBGA)
18 17
16
15
14
13 12
11
10
9
8
7
6
5
4
3
2
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
0.5
8.50
10.00
+ 0.15
8.
50
0.
5
10.
00
+
0.
15
BOTTOM VIEW
A1 CORNER
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
1
2
3
4
5
6
7
8
9
10
11
12
13
14 15
16 17
18
A1 CORNER
TOP VIEW
C
0.
26R
ef
.
0.
86
R
e
f.
0.
20
C
SEATING PLANE
A
0.
16
~
0.
26
1.
60
M
a
x.
0.
08
C
B
0.15(4X)
0.27~0.37(184X)
PACKAGE SIZE : 10.00x10.00x1.60MM
UNIT : MM
Ball Pitch : 0.50
Ball Diameter : 0.3
Substrate Thickness : 0.26
Mold Thickness : 0.86
Package Type : 184L STK LFBGA
0.08 M C
0.15 M C A B
W99802G
 
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