參數(shù)資料
型號(hào)： W971GG6JB-25A
廠商： WINBOND ELECTRONICS CORP
元件分類： DRAM
英文描述： 64M X 16 DDR DRAM, 0.4 ns, PBGA84
封裝： 12.50 X 8 MM, ROHS COMPLIANT, WBGA-84
文件頁數(shù)： 1/86頁
文件大?。?/td> 1076K
代理商： W971GG6JB-25A
W971GG6JB
8M
× 8 BANKS × 16 BIT DDR2 SDRAM
Publication Release Date: Mar. 02, 2010
- 1 -
Revision A05
Table of Contents-
1.
GENERAL DESCRIPTION ...................................................................................................................4
2.
FEATURES ...........................................................................................................................................4
3.
KEY PARAMETERS .............................................................................................................................5
4.
BALL CONFIGURATION ......................................................................................................................6
5.
BALL DESCRIPTION............................................................................................................................7
6.
BLOCK DIAGRAM ................................................................................................................................8
7.
FUNCTIONAL DESCRIPTION..............................................................................................................9
7.1
Power-up and Initialization Sequence ...................................................................................................9
7.2
Mode Register and Extended Mode Registers Operation ...................................................................10
7.2.1
Mode Register Set Command (MRS)...............................................................................10
7.2.2
Extend Mode Register Set Commands (EMRS) ..............................................................11
7.2.2.1
Extend Mode Register Set Command (1), EMR (1)................................................11
7.2.2.2
DLL Enable/Disable................................................................................................12
7.2.2.3
Extend Mode Register Set Command (2), EMR (2)................................................13
7.2.2.4
Extend Mode Register Set Command (3), EMR (3)................................................14
7.2.3
Off-Chip Driver (OCD) Impedance Adjustment ................................................................15
7.2.3.1
Extended Mode Register for OCD Impedance Adjustment ....................................16
7.2.3.2
OCD Impedance Adjust..........................................................................................16
7.2.3.3
Drive Mode .............................................................................................................17
7.2.4
On-Die Termination (ODT)...............................................................................................18
7.2.5
ODT related timings .........................................................................................................18
7.2.5.1
MRS command to ODT update delay.....................................................................18
7.3
Command Function.............................................................................................................................20
7.3.1
Bank Activate Command..................................................................................................20
7.3.2
Read Command...............................................................................................................21
7.3.3
Write Command ...............................................................................................................21
7.3.4
Burst Read with Auto-precharge Command.....................................................................21
7.3.5
Burst Write with Auto-precharge Command.....................................................................21
7.3.6
Precharge All Command ..................................................................................................21
7.3.7
Self Refresh Entry Command ..........................................................................................21
7.3.8
Self Refresh Exit Command.............................................................................................22
7.3.9
Refresh Command ...........................................................................................................22
7.3.10
No-Operation Command ..................................................................................................23
7.3.11
Device Deselect Command..............................................................................................23
7.4
Read and Write access modes ...........................................................................................................23
7.4.1
Posted CAS ....................................................................................................................23
相關(guān)PDF資料
PDF描述
W971GG8JB-25 DDR DRAM, PBGA60
W9725G8JB-25I DDR DRAM, PBGA84
W972GG8JB-25I 256M X 8 DDR DRAM, 0.4 ns, PBGA60
W972GG8JB-18 256M X 8 DDR DRAM, 0.35 ns, PBGA60
W9751G6JB-18 32M X 16 DDR DRAM, 0.35 ns, PBGA84
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
W971GG6JB25I 功能描述:IC DDR2 SDRAM 1GBIT 84WBGA RoHS:是 類別:集成電路 (IC) >> 存儲(chǔ)器 系列:- 標(biāo)準(zhǔn)包裝:3,000 系列:- 格式 - 存儲(chǔ)器:EEPROMs - 串行 存儲(chǔ)器類型:EEPROM 存儲(chǔ)容量:32K (4K x 8) 速度:100kHz，400kHz 接口:I²C，2 線串口 電源電壓:2.5 V ~ 5.5 V 工作溫度:-40°C ~ 125°C 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:8-SOIC 包裝:帶卷 (TR) 其它名稱:CAV24C32WE-GT3OSTR
W971GG6JB-25I 制造商:Winbond Electronics 功能描述:-40~85 1GB DDR2 FOR INDUSTRY
W971GG6JB25ITR 制造商:Winbond Electronics Corp 功能描述:1G, DDR2-800, X16, IND TEMP
W971GG6JB25TR 制造商:Winbond Electronics Corp 功能描述:NR, DDR2-800, X16
W971GG6JB-3 制造商:Winbond Electronics Corp 功能描述:1GBIT DDRII
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