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參數(shù)資料
| 型號： | W971GG8JB-25 |
| 廠商： | WINBOND ELECTRONICS CORP |
| 元件分類： | DRAM |
| 英文描述： | DDR DRAM, PBGA60 |
| 封裝： | 8 X 12.50 MM, ROHS COMPLIANT, WBGA-60 |
| 文件頁數(shù)： | 1/86頁 |
| 文件大?。?/td> | 1031K |
| 代理商： | W971GG8JB-25 |
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W971GG8JB
16M
× 8 BANKS × 8 BIT DDR2 SDRAM
Publication Release Date: Aug. 11, 2010
- 1 -
Revision A01
Table of Contents-
1.
GENERAL DESCRIPTION ...................................................................................................................4
2.
FEATURES ...........................................................................................................................................4
3.
KEY PARAMETERS .............................................................................................................................5
4.
BALL CONFIGURATION ......................................................................................................................6
5.
BALL DESCRIPTION............................................................................................................................7
6.
BLOCK DIAGRAM ................................................................................................................................8
7.
FUNCTIONAL DESCRIPTION..............................................................................................................9
7.1
Power-up and Initialization Sequence ...................................................................................................9
7.2
Mode Register and Extended Mode Registers Operation ...................................................................10
7.2.1
Mode Register Set Command (MRS)...............................................................................10
7.2.2
Extend Mode Register Set Commands (EMRS) ..............................................................11
7.2.2.1
Extend Mode Register Set Command (1), EMR (1)................................................11
7.2.2.2
DLL Enable/Disable................................................................................................12
7.2.2.3
Extend Mode Register Set Command (2), EMR (2)................................................13
7.2.2.4
Extend Mode Register Set Command (3), EMR (3)................................................14
7.2.3
Off-Chip Driver (OCD) Impedance Adjustment ................................................................15
7.2.3.1
Extended Mode Register for OCD Impedance Adjustment ....................................16
7.2.3.2
OCD Impedance Adjust..........................................................................................16
7.2.3.3
Drive Mode .............................................................................................................17
7.2.4
On-Die Termination (ODT)...............................................................................................18
7.2.5
ODT related timings .........................................................................................................18
7.2.5.1
MRS command to ODT update delay.....................................................................18
7.3
Command Function.............................................................................................................................20
7.3.1
Bank Activate Command..................................................................................................20
7.3.2
Read Command ...............................................................................................................21
7.3.3
Write Command ...............................................................................................................21
7.3.4
Burst Read with Auto-precharge Command.....................................................................21
7.3.5
Burst Write with Auto-precharge Command.....................................................................21
7.3.6
Precharge All Command ..................................................................................................21
7.3.7
Self Refresh Entry Command ..........................................................................................21
7.3.8
Self Refresh Exit Command.............................................................................................22
7.3.9
Refresh Command ...........................................................................................................22
7.3.10
No-Operation Command ..................................................................................................23
7.3.11
Device Deselect Command..............................................................................................23
7.4
Read and Write access modes ...........................................................................................................23
7.4.1
Posted CAS ....................................................................................................................23
7.4.1.1
Examples of posted CAS operation......................................................................23
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
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| W9725G6IB-25 | 功能描述:IC DDR2-800 SDRAM 256MB 84-WBGA RoHS:是 類別:集成電路 (IC) >> 存儲器 系列:- 標(biāo)準(zhǔn)包裝:1,000 系列:- 格式 - 存儲器:EEPROMs - 串行 存儲器類型:EEPROM 存儲容量:4K (512 x 8) 速度:400kHz 接口:I²C，2 線串口 電源電壓:2.7 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC（0.173"，4.40mm 寬） 供應(yīng)商設(shè)備封裝:8-MFP 包裝:帶卷 (TR) |
| W9725G6JB | 制造商:WINBOND 制造商全稱:Winbond 功能描述:4M ? 4 BANKS ? 16 BIT DDR2 SDRAM |
| W9725G6JB-25 | 制造商:Winbond Electronics Corp 功能描述:DRAM Chip DDR2 SDRAM 256M-Bit 16Mx16 1.8V 84-Pin WBGA 制造商:Winbond Electronics 功能描述:512MB DDRII |
| W9725G6JB25I | 功能描述:IC DDR2 SDRAM 256MBIT 84WBGA RoHS:是 類別:集成電路 (IC) >> 存儲器 系列:- 標(biāo)準(zhǔn)包裝:150 系列:- 格式 - 存儲器:EEPROMs - 串行 存儲器類型:EEPROM 存儲容量:4K (2 x 256 x 8) 速度:400kHz 接口:I²C，2 線串口 電源電壓:2.5 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-VFDFN 裸露焊盤 供應(yīng)商設(shè)備封裝:8-DFN（2x3） 包裝:管件 產(chǎn)品目錄頁面:1445 (CN2011-ZH PDF) |
| W9725G6KB-18 | 制造商:Winbond Electronics 功能描述:IC MEMORY 制造商:Winbond Electronics Corp 功能描述:IC MEMORY |
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