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參數(shù)資料
| 型號(hào)： | W764M32V100SBI |
| 廠商： | WHITE ELECTRONIC DESIGNS CORP |
| 元件分類(lèi)： | PROM |
| 英文描述： | 64M X 32 FLASH 3V PROM, 100 ns, PBGA107 |
| 封裝： | 14 X 17 MM, 1 MM PITCH, PLASTIC, BGA-107 |
| 文件頁(yè)數(shù)： | 6/16頁(yè) |
| 文件大?。?/td> | 511K |
| 代理商： | W764M32V100SBI |
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White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
W764M32V-XSBX
June 2009
Rev. 6
White Electronic Designs Corp. reserves the right to change products or specications without notice.
FIGURE 12: ALTERNATE CS# CONTROLLED WRITE (ERASE/PROGRAM) OPERATION TIMINGS
Addresses
555 for Program
2AA for Erase
PA
tWC
WE#
OE#
CS#
Data
tAS
tAH
tCPH
tWS
DQ7#
RESET#
tDH
tDS
PD for Program
30 for Sector Erase
10 for Chip Erase
PA for Program
SA for Sector Erase
555 for Chip Erase
Data# Polling
tWH
tGHEL
tWHWH1 OR 2
tBUSY
tHR
A0 for Program
55 for Erase
RY/BY#
tCP
DOUT
NOTES:
1.
Figure indicates last two bus cycles of a program or erase operation.
2.
PA = program address, SA = sector address, PD = program data.
3.
DQ7 is the complement of the data written to the device. DOUT is the data written to the device.
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| W764M32V100SBI/T/R-C50700 | 制造商:Microsemi Corporation 功能描述:LOCKHEE DIE - Gel-pak, waffle pack, wafer, diced wafer on film |
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