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參數(shù)資料
| 型號(hào)： | W72M64VK100BI |
| 廠商： | WHITE ELECTRONIC DESIGNS CORP |
| 元件分類： | PROM |
| 英文描述： | 2M X 64 FLASH 3.3V PROM MODULE, 100 ns, PBGA159 |
| 封裝： | 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159 |
| 文件頁(yè)數(shù)： | 7/16頁(yè) |
| 文件大?。?/td> | 555K |
| 代理商： | W72M64VK100BI |
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White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
W72M64VK-XBX
April 2005
Rev. 0
PACKAGE: 159 PBGA
WHITE ELECTRONIC DESIGNS CORP.:
Flash:
Organization, 2M x 64:
User Congurable as 2 x 2M x 32
3.3V Power Supply:
Internal Bank Architecture:
K = 4 bank architecture per 2Mx16 die
Access Time (ns):
90 = 90ns
100 = 100ns
120 = 120ns
Package Type:
B = 159 Plastic BGA, 13mm x 22mm
Device Grade:
M = Military Screened
-55°C to +125°C
I = Industrial
-40°C to +85°C
C = Commercial
0°C to +70°C
W 7 2M64 V K XXX B X
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| W78M64110SBM | 8M X 64 FLASH 3.3V PROM, 110 ns, PBGA159 |
| W78M64110SBI | 8M X 64 FLASH 3.3V PROM, 110 ns, PBGA159 |
| W78M64120SBI | 8M X 64 FLASH 3.3V PROM, 120 ns, PBGA159 |
| W78M64110SBC | 8M X 64 FLASH 3.3V PROM, 110 ns, PBGA159 |
| W78M64V100SBC | 8M X 64 FLASH 3.3V PROM MODULE, 100 ns, PBGA159 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| W72M64VK100BM | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package |
| W72M64VK120BC | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package |
| W72M64VK120BI | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package |
| W72M64VK120BM | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package |
| W72M64VK90BC | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package |
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