參數(shù)資料
型號: W3H64M72E-667ES
廠商: WHITE ELECTRONIC DESIGNS CORP
元件分類: DRAM
英文描述: 64M X 72 DDR DRAM, PBGA208
封裝: 17 X 23 MM, 1 MM PITCH, PLASTIC, BGA-208
文件頁數(shù): 24/30頁
文件大?。?/td> 999K
代理商: W3H64M72E-667ES
W3H64M72E-XSBX
30
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
December 2006
Rev. 2
ADVANCED*
White Electronic Designs Corp. reserves the right to change products or specications without notice.
Document Title
64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package
Revision History
Rev #
History
Release Date
Status
Rev 0
Initial Release
December 2005
Advanced
Rev 1
Changes (All pages)
1.1 Add additional technical data
March 2006
Advanced
Rev 2
Changes (Pg. 3)
2.1 Corrections to Pin Conguration
December 2006
Advanced
相關(guān)PDF資料
PDF描述
W3HG128M64EEU534D4IMG 128M X 64 DDR DRAM MODULE, 0.5 ns, ZMA200
W3HG128M64EEU806D4SG 128M X 64 DDR DRAM MODULE, 0.45 ns, ZMA200
W3HG128M64EEU665D4ISG 128M X 64 DDR DRAM MODULE, 0.45 ns, ZMA200
W3HG128M72AEF665F1SAG DDR DRAM MODULE, DMA240
W3HG128M72AEF534F1GBG DDR DRAM MODULE, DMA240
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
W3H64M72E-667ESC 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package
W3H64M72E-667ESI 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package
W3H64M72E-667ESM 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package
W3H64M72E-667SB 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package
W3H64M72E-667SBC 制造商:Microsemi Corporation 功能描述:64M X 72 DDR2, 1.8V, 667MHZ, 208PBGA COMMERICAL TEMP. - Bulk