參數(shù)資料
型號(hào): W3H32M64EA-533SBC
廠商: MICROSEMI CORP-PMG MICROELECTRONICS
元件分類: DRAM
英文描述: 32M X 64 DDR DRAM, PBGA208
封裝: 16 X 20 MM, 1 MM PITCH, PLASTIC, BGA-208
文件頁(yè)數(shù): 21/28頁(yè)
文件大?。?/td> 1057K
代理商: W3H32M64EA-533SBC
28
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
February 2010 2010 White Electronic Designs Corp. All rights reserved
Rev. 0
ADVANCED
White Electronic Designs Corp. reserves the right to change products or specications without notice.
W3H32M64EA-XSBX
Document Title
32M x 64 DDR2 SDRAM Single-Rank 208 PBGA MCP
Revision History
Rev #
History
Release Date
Status
Rev 0
Initial Release
February 2010
Advanced
相關(guān)PDF資料
PDF描述
W7NCF512H11IS3CG 32M X 16 FLASH 3.3V PROM CARD, 150 ns, UUC
W7NCF512H11IS9EG 32M X 16 FLASH 3.3V PROM CARD, 150 ns, UUC
W7NCF512H11ISABG 32M X 16 FLASH 3.3V PROM CARD, 150 ns, UUC
WE128K32N-300HC 512K X 8 EEPROM 5V MODULE, 300 ns, CPGA66
WF128K32-150CJC5 512K X 8 FLASH 5V PROM MODULE, 150 ns, CQCC68
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
W3H32M64E-ES 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package
W3H32M64E-ESC 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package
W3H32M64E-ESI 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package
W3H32M64E-ESM 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package
W3H32M64E-SB 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package