參數(shù)資料
型號(hào)： W3H32M64EA-533SBC
廠商： MICROSEMI CORP-PMG MICROELECTRONICS
元件分類： DRAM
英文描述： 32M X 64 DDR DRAM, PBGA208
封裝： 16 X 20 MM, 1 MM PITCH, PLASTIC, BGA-208
文件頁(yè)數(shù)： 11/28頁(yè)
文件大小： 1057K
代理商： W3H32M64EA-533SBC
19
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
February 2010 2010 White Electronic Designs Corp. All rights reserved
Rev. 0
ADVANCED
White Electronic Designs Corp. reserves the right to change products or specications without notice.
W3H32M64EA-XSBX
19
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
February 2010 2010 White Electronic Designs Corp. All rights reserved
Rev. 0
ADVANCED
White Electronic Designs Corp. reserves the right to change products or specications without notice.
W3H32M64EA-XSBX
FIGURE 12 – WRITE COMMAND
CS#
WE#
CAS#
RAS#
CKE
CA
A10
BANK ADDRESS
HIGH
EN AP
DIS AP
BA
CK
CK#
DON’T CARE
ADDRESS
Note: CA = column address; BA = bank address; EN AP = enable auto precharge; and
DIS AP = disable auto precharge.
TABLE 4 – WRITE USING CONCURRENT AUTO PRECHARGE
From Command (Bank n)
To Command (Bank m)
Minimum Delay (With Concurrent
Auto Precharge)
Units
WRITE with Auto Precharge
READ OR READ w/AP
(CL-1) + (BL/2) + tWTR
tCK
WRITE or WRITE w/AP
(BL/2)
tCK
PRECHARGE or ACTIVE
1
tCK
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
W3H32M64E-ES 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package
W3H32M64E-ESC 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package
W3H32M64E-ESI 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package
W3H32M64E-ESM 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package
W3H32M64E-SB 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package
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