型號: | W3H32M64EA-400SBI |
廠商: | MICROSEMI CORP-PMG MICROELECTRONICS |
元件分類: | DRAM |
英文描述: | 32M X 64 DDR DRAM, PBGA208 |
封裝: | 16 X 20 MM, 1 MM PITCH, PLASTIC, BGA-208 |
文件頁數(shù): | 20/28頁 |
文件大?。?/td> | 1057K |
代理商: | W3H32M64EA-400SBI |
相關(guān)PDF資料 |
PDF描述 |
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W7NCF512H11IS3JG | 32M X 16 FLASH 3.3V PROM CARD, 150 ns, UUC |
WE128K32-300G2Q | 128K X 32 EEPROM 5V MODULE, 300 ns, CQFP68 |
WE32K32N-65H1IA | 32K X 32 EEPROM 5V MODULE, 65 ns, CPGA66 |
WED3DG6418V7D2 | 16M X 64 SYNCHRONOUS DRAM MODULE, DMA168 |
WF2M32-150HM5 | 2M X 32 FLASH 5V PROM MODULE, 150 ns, CPGA66 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
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W3H32M64EA-400SBM | 制造商:Microsemi Corporation 功能描述:SDRAM MEMORY |
W3H32M64E-ES | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package |
W3H32M64E-ESC | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package |
W3H32M64E-ESI | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package |
W3H32M64E-ESM | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package |