參數(shù)資料
型號(hào)： W3H128M72ER-667SBI
廠商： MICROSEMI CORP-PMG MICROELECTRONICS
元件分類： DRAM
英文描述： 128M X 72 DDR DRAM, 0.5 ns, PBGA255
封裝： 23 X 21 MM, 1.27 MM PITCH, PLASTIC, BGA-255
文件頁(yè)數(shù)： 19/34頁(yè)
文件大?。?/td> 1028K
代理商： W3H128M72ER-667SBI
W3H128M72ER-XNBX
26
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
February 2009
Rev. 6
PRELIMINARY
White Electronic Designs Corp. reserves the right to change products or specications without notice.
DDR2 ICC SPECIFICATIONS AND CONDITIONS
-55°C ≤ TA ≤ 125°C
Symbol
Proposed Conditions
667
CL6
533
CL5
400
CL4
Units
ICC0
Operating one bank active-precharge current;
tCK = tCK(ICC), tRC = tRC(ICC), tRAS = tRASmin(ICC); CKE is HIGH, CS# is HIGH between valid commands;
Address bus inputs are SWITCHING; Data bus inputs are SWITCHING
540
460
mA
ICC1
Operating one bank active-read-precharge current;
IOUT = 0mA; BL = 4, CL = CL(ICC), AL = 0; tCK = tCK(ICC), tRC = tRC (ICC), tRAS = tRASmin(ICC), tRCD =
tRCD(ICC); CKE is HIGH, CS# is HIGH between valid commands; Address bus inputs are SWITCHING;
Data pattern is same as ICC4W
640
540
mA
ICC2P
Precharge power-down current;
All banks idle; tCK = tCK(ICC); CKE is LOW; Other control and address bus inputs are STABLE; Data
bus inputs are FLOATING
32
mA
ICC2Q
Precharge quiet standby current;
All banks idle; tCK = tCK(ICC); CKE is HIGH, CS# is HIGH; Other control and address bus inputs are
STABLE; Data bus inputs are FLOATING
260
180
160
mA
ICC2N
Precharge standby current;
All banks idle; tCK = tCK(ICC); CKE is HIGH, CS# is HIGH; Other control and address bus inputs are
SWITCHING; Data bus inputs are SWITCHING
280
240
200
mA
ICC3P
Active power-down current;
All banks open; tCK = tCK(ICC); CKE is LOW; Other control and
address bus inputs are STABLE; Data bus inputs are FLOATING
Fast PDN Exit MRS(12) = 0
160
140
120
mA
Slow PDN Exit MRS(12) = 1
40
mA
ICC3N
Active standby current;
All banks open; tCK = tCK(ICC), tRAS = tRASMAX(ICC), tRP = tRP(ICC); CKE is HIGH, CS# is HIGH between
valid commands; Other control and address bus inputs are SWITCHING; Data bus inputs are
SWITCHING
300
220
200
mA
ICC4W
Operating burst write current;
All banks open, Continuous burst writes; BL = 4, CL = CL(ICC), AL = 0; tCK = tCK(ICC), tRAS =
tRASMAX(ICC), tRP = tRP(ICC); CKE is HIGH, CS# is HIGH between valid commands; Address bus inputs
are SWITCHING; Data bus inputs are SWITCHING
1,000
760
640
mA
ICC4R
Operating burst read current;
All banks open, Continuous burst reads, IOUT = 0mA; BL = 4, CL = CL(ICC), AL = 0; tCK = tCK(ICC), tRAS =
tRASMAX(ICC), tRP = tRP(ICC); CKE is HIGH, CS# is HIGH between valid commands; Address bus inputs
are SWITCHING
1,100
780
720
mA
ICC5
Burst auto refresh current;
tCK = tCK(ICC); Refresh command at every tRFC(ICC) interval; CKE is HIGH, CS# is HIGH between valid
commands; Other control and address bus inputs are SWITCHING; Data bus inputs are SWITCHING
1,120
1,040
1,000
mA
ICC6
Self refresh current;
CK and CK# at 0V; CKE ≤ 0.2V; Other control and address bus
inputs
are FLOATING; Data bus inputs are FLOATING
Normal
16
mA
ICC7
Operating bank interleave read current;
All bank interleaving reads, IOUT = 0mA; BL = 4, CL = CL(ICC), AL = tRCD(ICC)-1*tCK(ICC); tCK = tCK(ICC),
tRC = tRC(ICC), tRRD = tRRD(ICC), tRCD = 1*tCK(ICC); CKE is HIGH, CS# is HIGH between valid commands;
Address bus inputs are STABLE during DESELECTs; Data bus inputs are switching
1,580
1,420
mA
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