參數(shù)資料
型號(hào): W25Q16CLZPIP
廠商: WINBOND ELECTRONICS CORP
元件分類: PROM
英文描述: 16M X 1 SPI BUS SERIAL EEPROM, PDSO8
封裝: 6 X 5 MM, GREEN , PLASTIC, WSON-8
文件頁數(shù): 74/77頁
文件大?。?/td> 2458K
代理商: W25Q16CLZPIP
W25Q16CL
- 76 -
14.1 Valid Part Numbers and Top Side Marking
The following table provides the valid part numbers for the W25Q16CL SpiFlash Memory. Please contact
Winbond for specific availability by density and package type. Winbond SpiFlash memories use an 12-
digit Product Number for ordering. However, due to limited space, the Top Side Marking on all packages
use an abbreviated 10-digit number.
Part Numbers for Industrial Temperature:
PACKAGE TYPE
DENSITY
PRODUCT NUMBER
TOP SIDE MARKING
SN
(2)
SOIC-8 150mil
16M-bit
W25Q16CLSNIG
W25Q16CLSNIP
25Q16CLNIG
25Q16CLNIP
SS
SOIC-8 208mil
16M-bit
W25Q16CLSSIG
W25Q16CLSSIP
25Q16CLSIG
25Q16CLSIP
SF
(2)
SOIC-16 300mil
16M-bit
W25Q16CLSFIG
W25Q16CLSFIP
25Q16CLFIG
25Q16CLFIP
ZP
(1)
WSON-8 6x5mm
16M-bit
W25Q16CLZPIG
W25Q16CLZPIP
25Q16CLIG
25Q16CLIP
DA
(2)
PDIP-8 300mil
16M-bit
W25Q16CLDAIG
W25Q16CLDAIP
25Q16CLAIG
25Q16CLAIP
Notes:
1. WSON package type ZP is not used in the top side marking.
2. These Package types are Special Order Only, please contact Winbond for more information.
相關(guān)PDF資料
PDF描述
W25Q16CLSFIG 16M X 1 SPI BUS SERIAL EEPROM, PDSO16
W25Q16CVSSIG 16M X 1 SPI BUS SERIAL EEPROM, PDSO8
W25Q16DWZPIP 16M X 1 SPI BUS SERIAL EEPROM, PDSO8
W25Q20BWUXIP 2M X 1 SPI BUS SERIAL EEPROM, PDSO8
W25Q32BVSSAG 32M X 1 SPI BUS SERIAL EEPROM, PDSO8
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
W25Q16CV 制造商:WINBOND 制造商全稱:Winbond 功能描述:3V 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q16CVDAAG 制造商:WINBOND 制造商全稱:Winbond 功能描述:3V 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q16CVDAAP 制造商:WINBOND 制造商全稱:Winbond 功能描述:3V 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q16CVDAIG 制造商:WINBOND 制造商全稱:Winbond 功能描述:3V 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q16CVDAIP 制造商:WINBOND 制造商全稱:Winbond 功能描述:3V 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI