參數(shù)資料
型號(hào): W25Q16CLZPIP
廠商: WINBOND ELECTRONICS CORP
元件分類: PROM
英文描述: 16M X 1 SPI BUS SERIAL EEPROM, PDSO8
封裝: 6 X 5 MM, GREEN , PLASTIC, WSON-8
文件頁(yè)數(shù): 68/77頁(yè)
文件大小: 2458K
代理商: W25Q16CLZPIP
W25Q16CL
- 70 -
13.2 8-Pin SOIC 208-mil (Package Code SS)
θ
GAUGE PLANE
θ
GAUGE PLANE
MILLIMETERS
INCHES
SYMBOL
Min
Nom
Max
Min
Nom
Max
A
1.75
1.95
2.16
0.069
0.077
0.085
A1
0.05
0.15
0.25
0.002
0.006
0.010
A2
1.70
1.80
1.91
0.067
0.071
0.075
b
0.35
0.42
0.48
0.014
0.017
0.019
C
0.19
0.20
0.25
0.007
0.008
0.010
D
5.18
5.28
5.38
0.204
0.208
0.212
D1
5.13
5.23
5.33
0.202
0.206
0.210
E
5.18
5.28
5.38
0.204
0.208
0.212
E1
5.13
5.23
5.33
0.202
0.206
0.210
e
(2)
1.27 BSC.
0.050 BSC.
H
7.70
7.90
8.10
0.303
0.311
0.319
L
0.50
0.65
0.80
0.020
0.026
0.031
y
---
0.10
---
0.004
θ
---
---
Notes:
1. Controlling dimensions: millimeters, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D1 and E1 do not include mold flash protrusions and should be measured from the bottom of the package.
4. Formed leads coplanarity with respect to seating plane shall be within 0.004 inches.
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