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參數(shù)資料
| 型號： | VSC7125 |
| 廠商： | Vitesse Semiconductor Corporation. |
| 英文描述： | Rotary Switch; Contact Current Max:1.5A; No. of Poles:4; No. of Switch Positions:11; Indexing:30 ; No. of Decks:4; Switch Terminals:Solder Lug; Circuitry:SPDT; Mounting Type:Panel; Switch Features:30 degrees Indexing RoHS Compliant: Yes |
| 中文描述： | 1.0625 Gbits / sec的光纖通道收發(fā)器 |
| 文件頁數(shù)： | 14/16頁 |
| 文件大小： | 123K |
| 代理商： | VSC7125 |
VITESSE
Data Sheet
VSC7125
1.0625 Gbits/sec Fibre
Channel Transceiver
Page 14
VITESSE
SEMICONDUCTOR CORPORATION
741 Calle Plano, Camarillo, CA 93012 805/388-3700 FAX: 805/987-5896
4/23/98
G52121-0, Rev. 4.1
Package Thermal Considerations
The VSC7125 is packaged in either a 10 mm PQFP or a 14 mm PQFP with internal heat spreaders. These
packages use industry-standard EIAJ footprints, but have been enhanced to improve thermal dissipation. The
construction of the packages is as shown in Figure 11.
Figure 11: Package Cross Section
Table 5: Thermal Resistance
The VSC7125 is designed to operate with a junction temperature up to 110
o
C. The user must guarantee that
the temperature specification is not violated. With the Thermal Resistances shown above, the 10x10mm PQFP
can operate in still air ambient temperatures of 53
o
C [53
o
C=110
o
C-0.9W*(10.5
o
C/W+53
o
C/W)] while the
14x14 PQFP can operate in still air ambient temperatures of 73
o
C [73
o
C=110
o
C-0.9W*(10
o
C/W+32
o
C/W)]. If
the ambient air temperature exceeds these limits then some form of cooling through a heatsink or an increase in
airflow must be provided.
Moisture Sensitivity Level
This device is rated with a moisture sensitivity level 3 rating. Refer to Application Note AN-20 for appro-
priate handling procedures.
Symbol
θ
jc
θ
ca
Description
10mm Value
14mm Value
Units
Thermal resistance from junction to case
10.5
10
o
C/W
Thermal resistance from case to ambient in still air including
conduction through the leads.
53
32
o
C/W
θ
ca-100
θ
ca-200
θ
ca-400
θ
ca-600
Thermal resistance from case to ambient with 100 LFM airflow
44
28
o
C/W
Thermal resistance from case to ambient with200 LFM airflow
39
25
o
C/W
Thermal resistance from case to ambient with 400 LFM airflow
34
22
o
C/W
Thermal resistance from case to ambient with 600 LFM airflow
31
20
o
C/W
Aluminum Heat Spreader
Plastic Molding Compound
Lead
Bond Wire
Die
Epoxy
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