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參數(shù)資料
| 型號： | V5.5MLA0805H |
| 英文描述： | DIODE SUPPRESS SMD BAUFORM 0805 5.5V |
| 中文描述： | 貼片二極管禁止BAUFORM 0805至5.5V |
| 文件頁數(shù)： | 9/12頁 |
| 文件大?。?/td> | 87K |
| 代理商： | V5.5MLA0805H |
5-11
Soldering Recommendations
The principal techniques used for the soldering of
components in surface mount technology are Infra Red (IR)
Reflow, Vapor Phase Reflow and Wave Soldering. When
wave soldering, the ML suppressor is attached to the
substrate by means of an adhesive. The assembly is then
placed on a conveyor and run through the soldering process.
With IR and Vapor Phase Reflow the device is placed in a
solder paste on the substrate. As the solder paste is heated
it reflows, and solders the unit to the board.
With the ML suppressor, the recommended solder is a 62/36/2
(Sn/Pb/Ag), 60/40 (Sn/Pb), or 63/37 (Sn/Pb). Harris also
recommends an RMA solder flux. Wave soldering operation is
the most strenuous of the processes. To avoid the possibility of
generating stresses due to thermal shock, a preheat stage in
the soldering process is recommended, and the peak
temperature of the solder process should be rigidly controlled.
When using a reflow process, care should be taken to
ensure that the ML chip is not subjected to a thermal
gradient steeper than 4 degrees per second; the ideal
gradient being 2 degrees per second. During the soldering
process, preheating to within 100 degrees of the solders
peak temperature is essential to minimize thermal shock.
Examples of the soldering conditions for the ML series of
suppressors are given in the tables below.
Once the soldering process has been completed, it is still
necessary to ensure that any further thermal shocks are
avoided. One possible cause of thermal shock is hot printed
circuit boards being removed from the solder process and
subjected to cleaning solvents at room temperature. The
boards must be allowed to cool to less than 50
o
C before
cleaning.
Termination Options
Harris offers two types of electrode termination finish for the
Multilayer product series:
1. Silver/Platinum (standard)
2. Silver/Palladium (optional)
(The ordering information section describes how to
designate them.)
FIGURE 12. WAVE SOLDER PROFILE
FIGURE 13. VAPOR PHASE SOLDER PROFILE
FIGURE 14. REFLOW SOLDER PROFILE
T
o
C
TIME (MINUTES)
300
250
200
150
100
50
0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
MAXIMUM WAVE 260
o
C
SECOND PREHEAT
FIRST PREHEAT
T
o
C
TIME (MINUTES)
250
200
150
100
50
0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
RAMP RATE
>50
C/s
PREHEAT ZONE
MAXIMUM
TEMPERATURE 222
o
C
40-80
SECONDS
ABOVE 183
o
C
T
o
C
TIME (MINUTES)
250
200
150
100
50
0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
MAXIMUM
PREHEAT DWELL
PREHEAT ZONE
TEMPERATURE 222
o
C
RAMP RATE
<2
C/s
40-80
SECONDS
ABOVE 183
o
C
ML Series
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