參數(shù)資料
型號(hào): V5.5MLA0805H
英文描述: DIODE SUPPRESS SMD BAUFORM 0805 5.5V
中文描述: 貼片二極管禁止BAUFORM 0805至5.5V
文件頁(yè)數(shù): 12/12頁(yè)
文件大小: 87K
代理商: V5.5MLA0805H
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ISO9000
quality systems certification.
Harris semiconductor products are sold by description only. Harris Semiconductor Communications Division reserves the right to make changes in circuit design and/or
specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Harris
is believed to be accurate and reliable. However, no responsibility is assumed by Harris or its subsidiaries for its use; nor for any infringements of patents or other rights
of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Harris or its subsidiaries.
For information regarding Harris Semiconductor Communications Division and its products, call
1-800-4-HARRIS
or see web site
http://www.semi.harris.com
5-14
Tape and Reel Specifications
Conforms to EIA - 481, Revision A
Can be Supplied to IEC Publication 286 - 3
SYMBOL
DESCRIPTION
MILLIMETERS
A
0
Width of Cavity
Dependent on Chip Size to Minimize Rotation.
B
0
Length of Cavity
Dependent on Chip Size to Minimize Rotation.
K
0
Depth of Cavity
Dependent on Chip Size to Minimize Rotation.
W
Width of Tape
8
±
0.2
F
Distance Between Drive Hole Centers and Cavity Centers
3.5
±
0.5
E
Distance Between Drive Hole Centers and Tape Edge
1.75
±
0.1
P
1
Distance Between Cavity Center
4
±
0.1
P
2
Axial Distance Between Drive Hole Centers and Cavity Centers
2
±
0.1
P
0
Axial Distance Between Drive Hole Centers
4
±
0.1
D
0
Drive Hole Diameter
1.55
±
0.05
D
1
Diameter of Cavity Piercing
1.05
±
0.05
t
1
Embossed Tape Thickness
0.3 Max
t
2
Top Tape Thickness
0.1 Max
NOTE: Dimensions in millimeters.
K
0
t
1
t
2
D
0
P
0
D
1
P
1
A
0
P
2
B
0
F
E
W
PLASTIC CARRIER TAPE
EMBOSSMENT
TOP TAPE
M0
NOMINAL
PRODUCT
IDENTIFYING
LABEL
178mm
OR 330mm
DIA. REEL
ML Series
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