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參數(shù)資料
| 型號： | V048F015T100 |
| 廠商： | Vicor Corporation |
| 元件分類： | DC/DC變換器 |
| 英文描述： | VI Chip - PRM-AL Pre-Regulator Module |
| 中文描述： | 六芯片-大羅馬尼亞黨鋁預(yù)穩(wěn)壓模塊 |
| 文件頁數(shù)： | 14/16頁 |
| 文件大?。?/td> | 497K |
| 代理商： | V048F015T100 |
Vicor Corporation
Tel: 800-735-6200
vicorpower.com
VI Chip Voltage Transformation Module
V048K015T090
Rev. 1.0 Page 14 of 16
Application Note (continued)
PRELIMINARY
VI Chip Soldering Recommendations
VI Chip modules are intended for reflow soldering processes.
The following information defines the processing conditions
required for successful attachment of a VI Chip to a PCB.
Failure to follow the recommendations provided can result in
aesthetic or functional failure of the module.
Storage
VI Chip modules are currently rated at MSL 5. Exposure to
ambient conditions for more than 72 hours requires a 24 hour
bake at 125oC to remove moisture from the package.
Solder Paste Stencil Design
Solder paste is recommended for a number of reasons, including
overcoming minor solder sphere co-planarity issues as well as
simpler integration into overall SMD process.
63/37 SnPb, either no-clean or water-washable, solder paste
should be used. Pb-free development is underway.
The recommended stencil thickness is 6 mils. The apertures
should be 20 mils in diameter for the In-Board (BGA)
application and 0.9-0.9:1 for the On-Board (J-Leaded).
Pick & Place
In-Board (BGA) modules should be placed as accurately as
possible to minimize any skewing of the solder joint; a maximum
offset of 10 mils is allowable. On-Board (J-Leaded) modules
should be placed within ±5 mils.
To maintain placement position, the modules should not be
subjected to acceleration greater than 500 in/sec
2
prior to reflow.
Reflow
There are two temperatures critical to the reflow process; the
solder joint temperature and the module’s case temperature. The
solder joint’s temperature should reach at least 220oC, with a
time above liquidus (183oC) of ~30 seconds.
The module’s case temperature must not exceed 208 oC at
anytime during reflow.
Because of the
T needed between the pin and the case, a forced-
air convection oven is preferred for reflow soldering. This
reflow method generally transfers heat from the PCB to the
solder joint. The module’s large mass also reduces its
temperature rise. Care should be taken to prevent smaller
devices from excessive temperatures. Reflow of modules onto a
PCB using Air-Vac-type equipment is not recommended due to
the high temperature the module will experience.
Inspection
For the BGA-version, a visual examination of the post-reflow
solder joints should show relatively columnar solder joints with
no bridges. An inspection using x-ray equipment can be done,
but the module’s materials may make imaging difficult.
The J-Lead version’s solder joints should conform to IPC 12.2
Properly Wetted Fillet must be evident
Heel fillet height must exceed lead thickness plus solder thickness.
Removal and Rework
VI Chip modules can be removed from PCBs using special tools
such as those made by Air-Vac. These tools heat a very localized
region of the board with a hot gas while applying a tensile force
to the component (using vacuum). Prior to component heating
and removal, the entire board should be heated to 80-100oC to
decrease the component heating time as well as local PCB
warping. If there are adjacent moisture-sensitive components, a
125oC bake should be used prior to component removal to
prevent popcorning. VI Chip modules should not be expected to
survive a removal operation.
Case Temperature, 208oC
Joint Temperature, 220oC
239
165
91
16
degC
183
Soldering Time
Figure 26
—Thermal profile diagram
Figure 27
— Properly reflowed VI Chip J-Lead.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| V048F015T80 | VI Chip - VTM Voltage Transformation Module |
| V048F030T070 | VI Chip - VTM Voltage Transformation Module |
| V048K030T070 | VI Chip - VTM Voltage Transformation Module |
| V048F040M050 | VI Chip - VTM Voltage Transformation Module |
| V048F040T050 | VI Chip - VTM Voltage Transformation Module |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| V048F015T80 | 制造商:VICOR 制造商全稱:Vicor Corporation 功能描述:VI Chip - VTM Voltage Transformation Module |
| V048F020M006 | 制造商:POWERBOX 制造商全稱:Powerbox 功能描述:300W DC/DC VOLTAGE TRANSFORMATION MODULE PRELIMINARY |
| V048F020M009 | 制造商:POWERBOX 制造商全稱:Powerbox 功能描述:300W DC/DC VOLTAGE TRANSFORMATION MODULE PRELIMINARY |
| V048F020M012 | 制造商:POWERBOX 制造商全稱:Powerbox 功能描述:300W DC/DC VOLTAGE TRANSFORMATION MODULE PRELIMINARY |
| V048F020M015 | 制造商:POWERBOX 制造商全稱:Powerbox 功能描述:300W DC/DC VOLTAGE TRANSFORMATION MODULE PRELIMINARY |
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