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參數(shù)資料
| 型號： | V040K033T060 |
| 廠商： | Vicor Corporation |
| 元件分類： | DC/DC變換器 |
| 英文描述： | VI Chip - PRM-AL Pre-regulator Module |
| 中文描述： | 六芯片-大羅馬尼亞黨鋁預(yù)穩(wěn)壓模塊 |
| 文件頁數(shù)： | 14/15頁 |
| 文件大?。?/td> | 544K |
| 代理商： | V040K033T060 |
vicorpower.com
800-735-6200
VI Chip Pre-Regulator Module
P048K048T24AL
Rev. 1.4
Page 14 of 15
PRELIMINARY
VI Chip soldering recommendations
VI Chip modules are intended for reflow soldering processes. The
following information defines the processing conditions required for
successful attachment of a VI Chip to a PCB. Failure to follow the
recommendations provided can result in aesthetic or functional failure
of the module.
Storage
VI Chip modules are currently rated at MSL 5. Exposure to ambient
conditions for more than 72 hours requires a 24 hour bake at 125oC
to remove moisture from the package.
Solder paste stencil design
Solder paste is recommended for a number of reasons, including
overcoming minor solder sphere co-planarity issues as well as simpler
integration into overall SMD process.
63/37 SnPb, either no-clean or water-washable, solder paste should be
used. Pb-free development is underway.
The recommended stencil thickness is 6 mils. The apertures should be
20 mils in diameter for the Inboard (BGA) application and 0.9-0.9:1 for
the Onboard (J-Leaded).
Pick and place
Inboard (BGA) modules should be placed as accurately as possible
to minimize any skewing of the solder joint; a maximum offset of
10 mils is allowable. Onboard (J-Leaded) modules should be placed
within ±5 mils.
To maintain placement position, the modules should not be subjected
to acceleration greater than 500 in/sec
2
prior to reflow.
Reflow
There are two temperatures critical to the reflow process; the solder
joint temperature and the module’s case temperature. The solder joint’s
temperature should reach at least 220oC, with a time above liquidus
(183oC) of ~30 seconds.
The module’s case temperature must not exceed 208 oC at anytime
during reflow.
Because of the
Δ
T needed between the pin and the case, a forced-air
convection oven is preferred for reflow soldering. This reflow method
generally transfers heat from the PCB to the solder joint. The module’s
large mass also reduces its temperature rise. Care should be taken to
prevent smaller devices from excessive temperatures. Reflow of
modules onto a PCB using Air-Vac-type equipment is not recommended
due to the high temperature the module will experience.
Inspection
For the BGA-version, a visual examination of the post-reflow solder
joints should show relatively columnar solder joints with no bridges.
An inspection using x-ray equipment can be done, but the module’s
materials may make imaging difficult.
The J-Lead versions solder joints should conform to IPC 12.2
Properly wetted fillet must be evident.
Heel fillet height must exceed lead thickness plus solder thickness.
Removal and rework
VI Chip modules can be removed from PCBs using special tools such
as those made by Air-Vac. These tools heat a very localized region of
the board with a hot gas while applying a tensile force to the
component (using vacuum). Prior to component heating and removal,
the entire board should be heated to 80-100oC to decrease the
component heating time as well as local PCB warping. If there are
adjacent moisture-sensitive components, a 125oC bake should be used
prior to component removal to prevent popcorning. VI Chip modules
should not be expected to survive a removal operation.
Case Temperature, 208oC
Joint Temperature, 220oC
23
9
165
9
1
16
degC
183
Soldering Time
Figure 23
—Thermal profile diagram
Figure 24
— Properly reflowed VI Chip J-Lead
Application Information
VI Chip Pre-Regulator Module
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