參數(shù)資料
型號： UPGA301AE3
廠商： MICROSEMI CORP-SCOTTSDALE
元件分類： 晶閘管
英文描述： Nanosecond SCR SWITCH
中文描述： 100 V, SCR
封裝： ROHS COMPLIANT, PLASTIC PACKAGE-3
文件頁數(shù)： 1/4頁
文件大?。?/td> 146K
代理商： UPGA301AE3
Microsemi
Copyright
2005
7-17-05, Rev D
W
M
.
C
UPGA301Ae3
Nanosecond SCR SWITCH
SCOTTSDALE DIVISION
D E S C R I P T I O N
Epoxy packaged, oxide passivated planar
SCR chips with metallurgic bonds on both
sides to achieve high reliability. Internal
wire bond connection allows high current
surge capability for narrow pulse
applications.
The UPGA301Ae3 is Designed for
high current narrow-pulse switching
applications where size and current
handling capability are critical.
These devices may be triggered on
using low power logic drivers from
(+0.8 V at 200
μ
A).
IMPORTANT:
For the most current data, consult
MICROSEMI
’swebsite:
http://www.microsemi.com
ABS OLUT E MAX IMUM RAT INGS AT 25o C
(UNLES S OT HERWIS E S PECIFIED)
Rating
Symbol
Value
Unit
Repetative peak Off-State Voltage
Peak On-State Current for 50 ns (max)
Peak Gate Current
Reverse Gate Voltage
Storage Temperature Range
Operating Temperature Range
V
DRM
I
TSM
I
GM
V
GR
T s
T
J
100
100
250
5
V
A
mA
V
oC
oC
-50 to 150
0 to 125
T HERMAL CHARACT ERIS T ICS
(UNLES S OT HERWIS E S PECIFIED)
(1)When mounted on 0.06’ thick FR4 board with 2 oz copper FR4 board with recommended footprint
Thermal Resistance
Junction-to-Case (Anode Bottom)
Junction-to-Ambient (1)
R
θ
JC
R
θ
JA
4.0
65
oC/Watt
oC/Watt
Small foot print
.
190 X .270 inches
1:1 Actual size
See mounting pad details on pg 3
K E Y F E A T U R E S
Very low thermal resistance package
Efficient heat path with integral
locking bottom metal tab
Full metallic bottom eliminates flux
entrapment
RoHS Compliant with e3 suffix
High speed switching capability
Compatible with high-speed insertion
Low profile height of 1 mm
APPLICAT IONS /BENEFIT S
Reference Microsemi MicroNote 601
and 602
Nanosecond SCR switch for reliable
high current pulse generators,
modulators and photo-flash
quenching
Logic drive capability (0.8V, 200
μ
A)
Ideal for Laser Range finder and
Camera Applications
Ideal for Automotive Collision
Avoidance Applications
MECHANICAL & PACK AGING
CASE: Void-free transfer molded
thermosetting epoxy compound
meeting UL94V-0
FINISH: Annealed matte-Tin plating
over copper and readily solderable per
MIL-STD-750 method 2026 (consult
factory for Tin-Lead plating)
POLARITY: See figure (left)
MARKING: 301A
WEIGHT: 0.072 gram (approx.)
Package dimensions on last page
Tape & Reel option: 16 mm tape per
Standard EIA-481-B, 5000 on 13” reel
U
P
G
A
3
0
1
A
8700 E. Thomas Rd. PO Box 1390, Scottsdale Arizona 85252, 480-941-6300, Fax: 480-947-1503
Page 1
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