- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄379508 > UPD78P4038YGK-BE9 (NEC Corp.) 16/8-BIT SINGLE-CHIP MICROCONTROLLER PDF資料下載
參數(shù)資料
| 型號： | UPD78P4038YGK-BE9 |
| 廠商： | NEC Corp. |
| 英文描述： | 16/8-BIT SINGLE-CHIP MICROCONTROLLER |
| 中文描述： | 16/8-BIT單片機(jī) |
| 文件頁數(shù)： | 60/72頁 |
| 文件大?。?/td> | 435K |
| 代理商： | UPD78P4038YGK-BE9 |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁當(dāng)前第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁第72頁
μ
PD78P4038Y
60
Table 13-1. Soldering Conditions for Surface-Mount Devices (2/2)
(3)
μ
PD78P4038YGK-BE9: 80-pin plastic TQFP (fine pitch) (12
×
12 mm)
Note
Maximum number of days during which the product can be stored at a temperature of 25
°
C and a relative
humidity of 65% or less after dry-pack package is opened.
Caution Do not apply two or more different soldering methods to one chip (except for partial heating
method for terminal sections).
Soldering Process
Infrared ray reflow
VPS
Partial heating method
Symbol
IR35-107-2
VP15-107-2
–
Soldering Conditions
Peak package’s surface temperature: 235
°
C
Reflow time: 30 seconds or less (210
°
C or more)
Maximum allowable number of reflow processes: 2
Exposure limit: 7 days
Note
(10 hours of pre-baking is required at 125
°
C
afterward)
<Caution>
Non-heat-resistant trays, such as magazine and taping trays, cannot be
baked before unpacking.
Peak package’s surface temperature: 215
°
C
Reflow time: 40 seconds or less (200
°
C or more)
Maximum allowable number of reflow processes: 2
Exposure limit: 7 days
Note
(10 hours of pre-baking is required at 125
°
C
afterward)
<Caution>
Non-heat-resistant trays, such as magazine and taping trays, cannot be
baked before unpacking.
Terminal temperature: 300
°
C or less
Heat time: 3 seconds or less (for one side of a device)
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| UPD78P4038YKK-T | 16/8-BIT SINGLE-CHIP MICROCONTROLLER |
| UPD78P4038YGK | RECTIFIER BRIDGE 2A 50V 65A-ifsm 1.1V-vf 5uA-ir KBP 35/TUBE |
| UPD78P4038Y | 16/8-BIT SINGLE-CHIP MICROCONTROLLER |
| UPD78P4038YGC-3B9 | 16/8-BIT SINGLE-CHIP MICROCONTROLLER |
| UPD78P4038YGC-8BT | 16/8-BIT SINGLE-CHIP MICROCONTROLLER |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| UPD79F8513AGB-8ES-A | 制造商:Renesas Electronics Corporation 功能描述:RENUPD79F8513AGB-8ES-A 8BIT FLASH MCU |
| UPD800227F1-011-MN5-A | 制造商:Renesas Electronics Corporation 功能描述: |
| UPD800232F1-012-HN2-A | 制造商:Renesas Electronics Corporation 功能描述: |
| UPD800232F1-014-HN2-A | 制造商:Renesas Electronics Corporation 功能描述: |
| UPD800261F1-816-HN2-A | 制造商:Renesas Electronics Corporation 功能描述: |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。