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參數(shù)資料
| 型號： | UPD78P4038YGK-BE9 |
| 廠商： | NEC Corp. |
| 英文描述： | 16/8-BIT SINGLE-CHIP MICROCONTROLLER |
| 中文描述： | 16/8-BIT單片機(jī) |
| 文件頁數(shù)： | 59/72頁 |
| 文件大小： | 435K |
| 代理商： | UPD78P4038YGK-BE9 |
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μ
PD78P4038Y
59
13. RECOMMENDED SOLDERING CONDITIONS
The conditions listed below shall be met when soldering the
μ
PD78P4038Y.
For details of the recommended soldering conditions, refer to our document
Semiconductor Device Mounting
Technology Manual
(C10535E).
Please consult with our sales offices in case any other soldering process is used, or in case soldering is done under
different conditions.
Table 13-1. Soldering Conditions for Surface-Mount Devices (1/2)
(1)
μ
PD78P4038YGC-3B9: 80-pin plastic QFP (14
×
14
×
2.7 mm)
Caution Do not apply two or more different soldering methods to one chip (except for partial heating
method for terminal sections).
(2)
μ
PD78P4038YGC-8BT: 80-pin plastic QFP (14
×
14
×
1.4 mm)
Caution Do not apply two or more different soldering methods to one chip (except for partial heating
method for terminal sections).
Soldering Process
Soldering Conditions
Symbol
Infrared ray reflow
Peak package's surface temperature: 235
°
C
Reflow time: 30 seconds or less (210
°
C or more)
Maximum allowable number of reflow processes: 2
IR35-00-2
VPS
Peak package's surface temperature: 215
°
C
Reflow time: 40 seconds or less (200
°
C or more)
Maximum allowable number of reflow processes: 2
VP15-00-2
Wave soldering
Solder temperature: 260
°
C or less
Flow time: 10 seconds or less
Number of flow processes: 1
Preheating temperature
WS60-00-1
:
120
°
C max.
(measured on the package surface)
Partial heating method
Terminal temperature: 300
°
C or less
Heat time: 3 seconds or less (for one side of a device)
–
Soldering Process
Soldering Conditions
Symbol
Infrared ray reflow
Peak package's surface temperature: 235
°
C
Reflow time: 30 seconds or less (210
°
C or more)
Maximum allowable number of reflow processes: 3
IR35-00-3
VPS
Peak package's surface temperature: 215
°
C
Reflow time: 40 seconds or less (200
°
C or more)
Maximum allowable number of reflow processes: 3
VP15-00-3
Wave soldering
Solder temperature: 260
°
C or less
Flow time: 10 seconds or less
Number of flow processes: 1
Preheating temperature
WS60-00-1
:
120
°
C max.
(measured on the package surface)
Partial heating method
Terminal temperature: 300
°
C or less
Heat time: 3 seconds or less (for one side of a device)
–
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