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參數(shù)資料
| 型號： | UPD78P368AKL-S |
| 廠商： | NEC Corp. |
| 元件分類： | 圓形連接器 |
| 英文描述： | Circular Connector; No. of Contacts:66; Series:MS27484; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:18; Circular Contact Gender:Socket; Circular Shell Style:Straight Plug; Insert Arrangement:18-35 RoHS Compliant: No |
| 中文描述： | 16 / 8位單片機 |
| 文件頁數(shù)： | 7/52頁 |
| 文件大小： | 545K |
| 代理商： | UPD78P368AKL-S |
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7
m
PD78P368A
CONTENTS
1.
PIN FUNCTIONS........................................................................................................................
1.1
NORMAL OPERATION MODE (MODE0 = L, MODE1 = L) .........................................................
1.2
PROM PROGRAMMING MODE (MODE0/V
PP
= H, MODE1 = L) ................................................
1.3
INPUT/OUTPUT CIRCUIT TYPE FOR EACH PIN AND HANDLING OF UNUSED PINS..........
8
8
10
11
2.
MEMORY CONFIGURATION...................................................................................................
13
3.
DIFFERENCES BETWEEN THE
m
PD78P368A AND
m
PD78366A .........................................
14
4.
PROM PROGRAMMING............................................................................................................
4.1
OPERATION MODE........................................................................................................................
4.2
PROCEDURE FOR WRITING ON PROM (PAGE PROGRAM MODE) ...............................
4.3
PROCEDURE FOR WRITING ON PROM (BYTE PROGRAM MODE)................................
4.4
PROCEDURE FOR READING FROM PROM...........................................................................
15
15
16
18
21
5.
ERASURE CHARACTERISTICS (
m
PD78P368AKL-S ONLY) ................................................
22
6.
PROTECTIVE FILM COVERING THE ERASURE WINDOW (
m
PD78P368AKL-S ONLY)........
22
7.
SCREENING ONE-TIME PROM PRODUCTS ..........................................................................
22
8.
ELECTRICAL SPECIFICATIONS .............................................................................................
23
9.
PACKAGE DRAWINGS.............................................................................................................
39
10. RECOMMENDED SOLDERING CONDITIONS......................................................................
41
APPENDIX A TOOLS ......................................................................................................................
A.1
DEVELOPMENT TOOLS ................................................................................................................
A.2
EMBEDDED SOFTWARE...............................................................................................................
42
42
47
APPENDIX B DIMENSIONS OF THE CONVERSION SOCKET AND RECOMMENDED
PATTERN ON BOARDS.........................................................................................
49
H
H
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