參數(shù)資料
型號： UPD784035YGK
廠商： NEC Corp.
英文描述： 16-/8-BIT SINGLE-CHIP MICROCONTROLLERS
中文描述： 16-/8-bit的單晶片微控制器
文件頁數(shù)： 86/94頁
文件大小： 503K
代理商： UPD784035YGK
μ
PD784035Y, 784036Y, 784037Y, 784038Y
86
15. RECOMMENDED SOLDERING CONDITIONS
It is recommended that the
μ
PD784035Y, 784036Y, 784037Y, and 784038Y be soldered under the following
conditions.
For details on the recommended soldering conditions, refer to information document “Semiconductor Device
Mounting Technology Manual” (C10535E).
For soldering methods and conditions other than those recommended, please consult an NEC representative.
Caution The soldering conditions for the
μ
PD784035YGK-
×××
-BE9 and 784036YGK-
×××
-BE9 are unde-
fined because these products are currently under development.
Table 15-1. Soldering Conditions for Surface Mount Type (1/2)
(1)
μ
PD784035YGC-
×××
-3B9: 80-pin plastic QFP (14
×
14 mm, 2.7-mm thick)
μ
PD784036YGC-
×××
-3B9: 80-pin plastic QFP (14
×
14 mm, 2.7-mm thick)
μ
PD784037YGC-
×××
-3B9: 80-pin plastic QFP (14
×
14 mm, 2.7-mm thick)
μ
PD784038YGC-
×××
-3B9: 80-pin plastic QFP (14
×
14 mm, 2.7-mm thick)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared ray reflow
Package peak temperature: 235
°
C, Reflow time: 30 seconds or less (210
°
C or more)
Number of reflow processes: 3 or less
IR35-00-3
VPS
Package peak temperature: 215
°
C, Reflow time: 40 seconds or less (200
°
C or more)
Number of reflow processes: 3 or less
VP15-00-3
Wave soldering
Solder bath temperature: 260
°
C or less, Flow time: 10 seconds or less,
Number of flow processes: 1, Preheating temperature: 120
°
C max.
(package surface temperature)
WS60-00-1
Partial heating
Pin temperature: 300
°
C or less, Flow time: 3 seconds or less
(for one side of the a device)
—
Caution Do not apply two or more different soldering methods to one chip (except for partial heating
method).
(2)
μ
PD784035YGC-
×××
-8BT: 80-pin plastic QFP (14
×
14 mm, 1.4-mm thick)
μ
PD784036YGC-
×××
-8BT: 80-pin plastic QFP (14
×
14 mm, 1.4-mm thick)
μ
PD784037YGC-
×××
-8BT: 80-pin plastic QFP (14
×
14 mm, 1.4-mm thick)
μ
PD784038YGC-
×××
-8BT: 80-pin plastic QFP (14
×
14 mm, 1.4-mm thick)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared ray reflow
Package peak temperature: 235
°
C, Reflow time: 30 seconds or less (210
°
C or more)
Number of reflow processes: 2 or less
IR35-00-2
VPS
Package peak temperature: 215
°
C, Reflow time: 40 seconds or less (200
°
C or more)
Number of reflow processes: 2 or less
VP15-00-2
Wave soldering
Solder bath temperature: 260
°
C or less, Flow time: 10 seconds or less,
Number of flow processes: 1, Preheating temperature: 120
°
C max.
(package surface temperature)
WS60-00-1
Partial heating
Pin temperature: 300
°
C or less, Flow time: 3 seconds or less
(for one side of the a device)
—
Caution Do not apply two or more different soldering methods to one chip (except for partial heating
method).
相關(guān)PDF資料
PDF描述
UPD784035Y 16-/8-BIT SINGLE-CHIP MICROCONTROLLERS
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UPD784037YGK TRANS PREBIASED DUAL NPN SOT363
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
UPD784038GC-392-8BT-A 制造商:Renesas Electronics Corporation 功能描述:
UPD784038GC-410-8BT-A 制造商:Renesas Electronics Corporation 功能描述:
UPD784218AGC-382-8EU-NRE-A 制造商:Renesas Electronics Corporation 功能描述:
UPD784218AGC-382-8EU-SES-A 制造商:Renesas Electronics Corporation 功能描述:
UPD784935AGF-113-3BA 制造商:NEC Electronics Corporation 功能描述:
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