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參數(shù)資料
| 型號(hào)： | UPD784031Y |
| 廠(chǎng)商： | NEC Corp. |
| 英文描述： | 16-/8-BIT SINGLE-CHIP MICROCONTROLLERS |
| 中文描述： | 16-/8-bit的單晶片微控制器 |
| 文件頁(yè)數(shù)： | 81/88頁(yè) |
| 文件大小： | 464K |
| 代理商： | UPD784031Y |
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81
μ
PD784031Y
Table 15-1. Surface Mounting Type Soldering Conditions (2/2)
(3)
μ
PD784031YGK-BE9: 80-pin plastic TQFP (fine pitch) (12
×
12 mm)
Soldering Method
Soldering Conditions
Symbol
Infrared reflow
Package peak temperature: 235
°
C, Duration: 30 sec. max. (at 210
°
C or above),
Number of times: Twice max., Time limit: 7 days
Note
(thereafter 10 hours prebaking
required at 125
°
C)
<precaution>
Do not bake devices by packing them in non-heat resistant trays or packing materials
such as magazine cases and tapes. Use heat-resistant trays.
IR35-107-2
VPS
Package peak temperature: 215
°
C, Duration: 40 sec. (at 200
°
C or above),
Number of times: Twice max., Time limit: 7 days
Note
(thereafter 10 hours prebaking
required at 125
°
C)
<precaution>
Do not bake devices by packing them in non-heat resistant trays or packing materials
such as magazine cases and tapes. Use heat-resistant trays.
VP15-107-2
Partial heating
Pin temperature: 300
°
C max. Duration: 3 sec. max. (per device side)
—
Note
For the storage period after dry-pack decapsulation, storage conditions are max. 25
°
C, 65 % RH.
Caution
Use of more than one soldering method should be avoided (except in the case of partial heating).
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| UPD784031YGC-8BT | 制造商:Renesas Electronics Corporation 功能描述: |
| UPD784031YGC-8BT-A | 制造商:Renesas Electronics Corporation 功能描述: |
| UPD784031YGK-9EU | 制造商:Renesas Electronics Corporation 功能描述: |
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| UPD784038GC-410-8BT-A | 制造商:Renesas Electronics Corporation 功能描述: |
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