參數(shù)資料
型號(hào)： UPD78368A
廠商： NEC Corp.
英文描述： 16/8-BIT SINGLE-CHIP MICROCONTROLLERS
中文描述： 16/8-BIT單晶片微控制器
文件頁數(shù)： 84/96頁
文件大?。?/td> 502K
代理商： UPD78368A
μ
PD78363A, 78365A, 78366A, 78368A
84
12. RECOMMENDED SOLDERING CONDITIONS
These products should be soldered and mounted under the conditions recommended below.
For details of recommended soldering conditions, refer to the information document
Semiconductor Device
Mounting Technology Manual (C10535E)
.
For soldering methods and conditions other than those recommended, please contact your NEC sales
representative.
Table 12-1. Surface Mount Type Soldering Conditions
μ
PD78363AGF-
×××
-3B9: 80-Pin Plastic QFP (14
×
20 mm)
μ
PD78365AGF-3B9
: 80-Pin Plastic QFP (14
×
20 mm)
μ
PD78366AGF-
×××
-3B9: 80-Pin Plastic QFP (14
×
20 mm)
μ
PD78368AGF-
×××
-3B9: 80-Pin Plastic QFP (14
×
20 mm)
Soldering method
Infrared reflow
VPS
Wave soldering
Partial heating
Caution Use of more than one soldering method should be avoided (except in the case of partial
heating).
Recommended
condition symbol
IR35-00-3
VP15-00-3
WS60-00-1
–
Soldering conditions
Package peak temperature: 235 C, Duration: 30 sec. max. (210 C or
above) Number of times: 3 max.
Package peak temperature: 215 C, Duration: 40 sec. max. (200 C or
above) Number of times: 3 max.
Solder bath temperature: 260 C or less, Time: 10 sec. max.,
Number of times: 1, Pre-heating temperature: 120 C max. (Package
surface temperature)
Pin temperature: 300 C or less
Duration: 3 sec. max. (per side of device)
相關(guān)PDF資料
PDF描述
UPD78368AGF 16/8-BIT SINGLE-CHIP MICROCONTROLLERS
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UPD78365AGF-3B9 Circular Connector; No. of Contacts:56; Series:MS27467; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:25; Circular Contact Gender:Pin; Circular Shell Style:Straight Plug; Insert Arrangement:25-4 RoHS Compliant: No
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