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參數(shù)資料
| 型號： | UPD78323 |
| 廠商： | NEC Corp. |
| 英文描述： | 16/8-BIT SINGLE-CHIP MICROCONTROLLER |
| 中文描述： | 16/8-BIT單片機 |
| 文件頁數(shù)： | 76/86頁 |
| 文件大小： | 454K |
| 代理商： | UPD78323 |
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76
μ
PD78323, 78324
11. RECOMMENDED SOLDERING CONDITIONS
The
μ
PD78323 and 78324 should be soldered and mounted under the conditions recommended in the table below.
For detail of recommended soldering conditions, refer to the information document
Semiconductor Device Mount-
ing Technology Manual
(IE1-1207)
.
For soldering methods and conditions other than those recommended below, contact our salesman.
Table 11-1. Soldering Conditions for Surface Mount Type
μ
PD78323GJ-5BJ
μ
PD78324GJ-
×××
-5BJ : 74-pin plastic QFP (20
×
20 mm)
: 74-pin plastic QFP (20
×
20 mm)
Soldering Method
Soldering Conditions
Package peak temperature: 230
°
C, Time: 30 sec. max. (at 210
°
C or above)
Number of times: Once, Time limit: 7 days
Note
(thereafter 10 hours prebaking
required at 125
°
C)
Infrared reflow
Package peak temperature: 215
°
C, Time: 40 sec. max. (at 200
°
C or above)
Number of times: Once, Time limit: 7 days
Note
(thereafter 10 hours prebaking
required at 125
°
C)
VPS
Pin temperature: 300
°
C max, Time: 3 sec. max. (Per side of the device)
Recommended
Condition Symbol
Soldering Method
Soldering Conditions
Package peak temperature: 235
°
C, Time: 30 sec. max. (at 210
°
C or above)
Number of times: twice or less, Time limit: 7 days
Note
(thereafter 36 hours
prebaking required at 125 C)
<Caution>
(1)
The second reflow should be started after the temperature of the device
which would have been changed by the first reflow has returned to normal.
(2)
Please avoid flux water washing after the first reflow.
Package peak temperature: 215
°
C, Time: 40 sec. max. (at 200
°
C or above),
Number of times: twice or less, Time limit: 7 days
Note
(thereafter 36 hours
prebaking required at 125 C)
<Caution>
(1)
The second reflow should be started after the temperature of the device
which would have been changed by the first reflow has returned to normal.
(2)
Please avoid flux water washing after the first reflow.
Pin temperature: 300
°
C max., Time: 3 sec. max. (Per side of the device))
Recommended
Condition Symbol
Infrared reflow
IR30-367-2
VP15-367-2
μ
PD78323LP
μ
PD78324LP-
×××
: 68-pin plastic QFJ (
: 68-pin plastic QFJ (
950 mil)
950 mil)
Pin part heating
IR30-107-1
VP15-107-1
VPS
Note
For the storage period after dry-pack decompression, storage conditions are max. 25
°
C, 65 % RH.
Caution Use more than one soldering method should be avoided (except in the case of pin part heating).
Pin part heating
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