- 您現在的位置：買賣IC網 > PDF目錄379506 > UPD78320 (NEC Corp.) 16/8-BIT SINGLE-CHIP MICROCONTROLLER PDF資料下載
參數資料
| 型號： | UPD78320 |
| 廠商： | NEC Corp. |
| 英文描述： | 16/8-BIT SINGLE-CHIP MICROCONTROLLER |
| 中文描述： | 16/8-BIT單片機 |
| 文件頁數： | 78/88頁 |
| 文件大?。?/td> | 479K |
| 代理商： | UPD78320 |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁第72頁第73頁第74頁第75頁第76頁第77頁當前第78頁第79頁第80頁第81頁第82頁第83頁第84頁第85頁第86頁第87頁第88頁
78
μ
PD78320, 78322
11. RECOMMENDED SOLDERING CONDITIONS
The
μ
PD78322 should be soldered and mounted under the conditions recommended in the table below.
For detail of recommended soldering conditions, refer to the information document
“Semiconductor Device Mounting
Technology Manual” (IE-1207)
.
For soldering methods and conditions other than those recommended below, contact our salesman.
μ
PD78320GF-3B9
μ
PD78322GF-
×××
-3B9 : 80-pin plastic QFP (14
×
20 mm)
μ
PD78320GJ-5BJ
: 74-pin plastic QFP (20
×
20 mm)
μ
PD78322GJ-
×××
-5BJ : 74-pin plastic QFP (20
×
20 mm)
: 80-pin plastic QFP (14
×
20 mm)
Table 11-1. Soldering Conditions for Surface Mount Type
Soldering Method
Soldering Conditions
Package peak temperature: 235
°
C, Time: 30 sec. max. (at 210
°
C or above),
Number of times: twice or less
<Caution>
(1)
The second reflow should be started after the temperature of the device which
would have been changed by the first reflow has returned to normal.
(2)
Please avoid flux water washing after the first reflow.
Package peak temperature: 215
°
C, Time: 40 sec. max. (at 200
°
C or above),
Number of times: twice or less
<Caution>
(1)
The second reflow should be started after the temperature of the device which
would have been changed by the first reflow has returned to normal.
(2)
Please avoid flux water washing after the first reflow.
Solder bath temperature: 260
°
C max. Time: 10 sec. max., Number of times: Once
Preheating temperature: 120
°
C max. (package surface temperature)
Pin temperature: 300
°
C max. Time: 3 sec. max. (Per device side)
Recommended
Condition Symbol
IR35-00-2
VP15-00-2
WS60-00-1
Pin part heating
VPS
Wave soldering
Infrared reflow
μ
PD78320L
μ
PD78322L-
×××
: 68-pin plastic QFJ (
: 68-pin plastic QFJ (
950 mil)
950 mil)
Infrared reflow
Soldering Method
Recommended
Condition Symbol
IR30-00-1
VP15-00-1
Soldering Conditions
Package peak temperature: 230
°
C, Time: 30 sec. max. (at 210
°
C or above),
Number of times: Once
Package peak temperature: 215
°
C, Time: 40 sec. max. (at 200
°
C or above),
Number of times: Once
Pin part temperature: 300
°
C max. Time: 3 sec. max. (Per device side)
VPS
Pin part heating
Caution Use more than one soldering method should be avoided (except in the case of pin part heating).
相關PDF資料 |
PDF描述 |
|---|---|
| UPD78320GF-3B9 | 16/8-BIT SINGLE-CHIP MICROCONTROLLER |
| UPD78320GJ-5BJ | 16/8-BIT SINGLE-CHIP MICROCONTROLLER |
| UPD78322GF | 16/8-BIT SINGLE-CHIP MICROCONTROLLER |
| UPD78322GJ | 16/8-BIT SINGLE-CHIP MICROCONTROLLER |
| UPD78320L | 16/8-BIT SINGLE-CHIP MICROCONTROLLER |
相關代理商/技術參數 |
參數描述 |
|---|---|
| UPD78365AGF3B9 | 制造商: 功能描述: 制造商:undefined 功能描述: |
| UPD784031GC-8BT-A | 制造商:Renesas Electronics Corporation 功能描述:MCU 8BIT/16BIT 78K4 CISC ROMLESS 3.3V/5V 80PQFP - Trays 制造商:Renesas Electronics 功能描述:16 制造商:Renesas Electronics 功能描述:16 Cut Tape |
| UPD784031GK-9EU-A | 制造商:Renesas Electronics Corporation 功能描述:16BIT K4 ROMLESS - Bulk |
| UPD784031YGC-8BT | 制造商:Renesas Electronics Corporation 功能描述: |
| UPD784031YGC-8BT-A | 制造商:Renesas Electronics Corporation 功能描述: |
發(fā)布緊急采購，3分鐘左右您將得到回復。