- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄379505 > UPD78058FY (NEC Corp.) 8-bit single-chip microcontroller PDF資料下載
參數(shù)資料
| 型號： | UPD78058FY |
| 廠商： | NEC Corp. |
| 元件分類： | 8位微控制器 |
| 英文描述： | 8-bit single-chip microcontroller |
| 中文描述： | 8位單片機(jī) |
| 文件頁數(shù)： | 64/72頁 |
| 文件大?。?/td> | 510K |
| 代理商： | UPD78058FY |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁當(dāng)前第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁第72頁
m
PD78042F, 78043F, 78044F, 78045F
64
#
13. RECOMMENDED SOLDERING CONDITIONS
The conditions listed below shall be met when soldering the
m
PD78042F,
m
PD78043F,
m
PD78044F, or
m
PD78045F.
For details of the recommended soldering conditions, refer to our document Semiconductor Device Mounting
Technology Manual(C10535E).
Please consult with our sales offices in case any other soldering process is used, or in case soldering is done under
different conditions.
Table 13-1 Soldering Conditions for Surface-Mount Devices
m
PD78042FGF-
m
PD78043FGF-
m
PD78044FGF-
m
PD78045FGF-
￥￥￥
-3B9: 80-pin plastic QFP (14
￥
20 mm)
￥￥￥
-3B9: 80-pin plastic QFP (14
￥
20 mm)
￥￥￥
-3B9: 80-pin plastic QFP (14
￥
20 mm)
￥￥￥
-3B9: 80-pin plastic QFP (14
￥
20 mm)
Caution Do not apply two or more different soldering methods to one chip (except for partial heating
method for terminal sections).
Soldering process
Soldering conditions
Recommended conditions
Infrared ray reflow
Peak package's surface temperature: 235 °C
Reflow time: 30 seconds or less (210 °C or more)
Maximum allowable number of reflow processes: 3
IR35-00-3
VPS
Peak package's surface temperature: 215 °C
Reflow time: 40 seconds or less (200 °C or more)
Maximum allowable number of reflow processes: 3
VP15-00-3
Wave soldering
Solder temperature: 260 °C or less
Flow time: 10 seconds or less
Number of flow processes: 1
Preheating temperature
WS60-00-1
: 120 °C max.
(measured on the package surface)
Partial heating method
Terminal temperature: 300 °C or less
Heat time: 3 seconds or less (for one side of a device)
—
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| UPD780018 | 1 watt dc-dc converters |
| UPD78045H | 1 watt dc-dc converters |
| UPD78046H | 1 watt dc-dc converters |
| UPD780018AY | 8-bit Microcontroller with 2/4/8K Bytes In-System Programmable Flash |
| UPD78001B | 1 watt dc-dc converters |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| UPD78063GF-144-3BA | 制造商:World Products 功能描述: |
| UPD78063GF-147-3BA | 制造商:Renesas Electronics Corporation 功能描述: |
| UPD78063GF-169-3BA | 制造商:Renesas Electronics Corporation 功能描述: |
| UPD78064GF-132-3BA | 制造商:Renesas Electronics Corporation 功能描述: |
| UPD78070AGF-3BA-A | 制造商:Renesas Electronics Corporation 功能描述:MCU 8-bit 78K 78K0 CISC ROMLess 3.3V/5V 100-Pin PQFP |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。