
μ
PD78F0034A, 78F0034AY
52
Data Sheet  U14040EJ4V0DS
9.  RECOMMENDED SOLDERING CONDITIONS
The 
μ
PD78F0034A, 78F0034AY should be soldered and mounted under the following recommended conditions.
For details of the recommended soldering conditions, refer to the document 
Semiconductor Device Mounting
Technology Manual (C10535E)
.
For soldering methods and conditions other than those recommended below, contact your NEC sales
representative.
Table 9-1.  Surface Mounting Type Soldering Conditions (1/2)
(1)
 μ
PD78F0034AGC-8BS: 64-pin plastic LQFP (14 
×
 14)
μ
PD78F0034AYGC-8BS: 64-pin plastic LQFP (14 
×
 14)
μ
PD78F0034AGC-AB8: 64-pin plastic QFP (14 
×
 14)
μ
PD78F0034AYGC-AB8: 64-pin plastic QFP (14 
×
 14)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 seconds max. (at 210
°
C or higher),
Count: Two times or less
IR35-00-2
VPS
Package peak temperature: 215
°
C, Time: 40 seconds max. (at 200
°
C or higher),
Count: Two times or less
VP15-00-2
Wave soldering
Solder bath temperature: 260
°
C max., Time: 10 seconds max., Count: Once,
Preheating temperature: 120
°
C max. (package surface temperature)
WS60-00-1
Partial heating
Pin temperature: 300
°
C max., Time: 3 seconds max. (per pin row)
–
Caution Do not use different soldering methods together (except for partial heating).
(2)
 μ
PD78F0034AGB-8EU: 64-pin plastic LQFP (10 
×
 10)
μ
PD78F0034AYGB-8EU: 64-pin plastic LQFP (10 
×
 10)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 seconds max. (at 210
°
C or higher),
Count: Two times or less,
Exposure limit: 7 days
Note
 (after 7 days, prebake at 125
°
C for 10 hours)
IR35-107-2
VPS
Package peak temperature: 215
°
C, Time: 40 seconds max. (at 200
°
C or higher),
Count: Two times or less,
Exposure limit: 7 days
Note
 (after 7 days, prebake at 125
°
C for 10 hours)
VP15-107-2
Partial heating
Pin temperature: 300
°
C max., Time: 3 seconds max. (per pin row)
–
Note
After opening the dry pack, store it at 25
°
C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).