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參數(shù)資料
| 型號： | UPD780023AGK-xxx-9ET |
| 廠商： | NEC Corp. |
| 元件分類： | 圓形連接器 |
| 英文描述： | Circular Connector; No. of Contacts:56; Series:MS27467; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:25; Circular Contact Gender:Pin; Circular Shell Style:Straight Plug; Insert Arrangement:25-4 RoHS Compliant: No |
| 中文描述： | 8位單晶片微控制器 |
| 文件頁數(shù)： | 84/96頁 |
| 文件大?。?/td> | 661K |
| 代理商： | UPD780023AGK-XXX-9ET |
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85
PD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY
Data Sheet U14042EJ4V0DS
Table 14-1. Surface Mounting Type Soldering Conditions (3/3)
(4)
PD780021AGB-×××
×××
×××-8EU: 64-pin plastic LQFP (10 x 10)
PD780022AGB-×××
×××
×××-8EU: 64-pin plastic LQFP (10 x 10)
PD780023AGB-×××
×××
×××-8EU: 64-pin plastic LQFP (10 x 10)
PD780024AGB-×××
×××
×××-8EU: 64-pin plastic LQFP (10 x 10)
PD780021AYGB-×××
×××
×××-8EU: 64-pin plastic LQFP (10 x 10)
PD780022AYGB-×××
×××
×××-8EU: 64-pin plastic LQFP (10 x 10)
PD780023AYGB-×××
×××
×××-8EU: 64-pin plastic LQFP (10 x 10)
PD780024AYGB-×××
×××
×××-8EU: 64-pin plastic LQFP (10 x 10)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°C, Time: 30 seconds max.
IR35-00-2
(at 210
°C or higher), Count: Twice or less
VPS
Package peak temperature: 215
°C, Time: 40 seconds max.
VP15-00-2
(at 200
°C or higher), Count: Twice or less
Partial heating
Pin temperature: 300
°C max., Time: 3 seconds max. (per pin row)
––
Caution
Do not use different soldering methods together (except for partial heating).
(5)
PD780021AF1-×××
×××
×××-CN3: 73-pin plastic FBGA (9 x 9)
PD780022AF1-×××
×××
×××-CN3: 73-pin plastic FBGA (9 x 9)
PD780023AF1-×××
×××
×××-CN3: 73-pin plastic FBGA (9 x 9)
PD780024AF1-×××
×××
×××-CN3: 73-pin plastic FBGA (9 x 9)
PD780021AYF1-×××
×××
×××-CN3: 73-pin plastic FBGA (9 x 9)
PD780022AYF1-×××
×××
×××-CN3: 73-pin plastic FBGA (9 x 9)
PD780023AYF1-×××
×××
×××-CN3: 73-pin plastic FBGA (9 x 9)
PD780024AYF1-×××
×××
×××-CN3: 73-pin plastic FBGA (9 x 9)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 260
°C, Time: 60 seconds max.
IR60-203-3
(at 220
°C or higher), Count: Three times or less, Exposure limit:
3 daysNote (after that, prebake at 125
°C for 20 hours)
VPS
Package peak temperature: 215
°C, Time: 40 seconds max.
VP15-203-3
(at 200
°C or higher), Count: Three times or less, Exposure limit:
3 daysNote (after that, prebake at 125
°C for 20 hours)
Note
After opening the dry pack, store it at 25
°C or less and 65%RH or less for the allowable storage period.
Caution Do not use different soldering methods together.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
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| UPD780024AGK-C42-9ET | 制造商:Renesas Electronics Corporation 功能描述: |
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| UPD780033AGK-B03-9ET | 制造商:Renesas Electronics Corporation 功能描述: |
| UPD780033AGK-B03-9ET-A | 制造商:Renesas Electronics Corporation 功能描述: |
| UPD780034AGC-119-8BS-A | 制造商:Renesas Electronics Corporation 功能描述:NECUPD780034AGC-119-8BS-A MCU |
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