參數(shù)資料
型號(hào)： UPD77113AF1-XXX-CN1
廠商： NEC Corp.
英文描述： MOS INTEGRATED CIRCUIT
中文描述： 馬鞍山集成電路
文件頁(yè)數(shù)： 58/62頁(yè)
文件大?。?/td> 352K
代理商： UPD77113AF1-XXX-CN1
Data Sheet U14373EJ3V0DS
58
μ
PD77113A, 77114
12. RECOMMENDED SOLDERING CONDITIONS
It is recommended to solder this product under the following recommended conditions.
For the details of the recommended soldering conditions, refer to the document
Semiconductor Device
Mounting Technology Manual (C10535E)
.
For soldering methods and conditions other than those recommended below, contact your NEC sales
representative.
Surface mount type
μ
PD77113AF1-xxx-CN1: 80-pin plastic fine-pitch BGA (9 x 9)
Soldering
Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 230
°
C, Time: 30 sec. Max. (at 210
°
C or higher).
Count: two times or less
Exposure limit: 3 days
Note
(after that prebake at 125
°
C for 10 hours)
IR30-103-2
Note
After opening the dry pack, store it at 25
°
C or less and 65% RH or less for the allowable storage period.
μ
PD77114GC-xxx-9EU: 100-pin plastic TQFP (fine-pitch) (14 x 14)
Soldering
Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 sec. Max. (at 210
°
C or higher).
Count: two times or less
Exposure limit: 3 days
Note
(after that prebake at 125
°
C for 10 hours)
IR35-103-2
VPS
Package peak temperature: 215
°
C, Time: 40 sec. Max. (at 200
°
C or higher).
Count: two times or less
Exposure limit: 3 days
Note
(after that prebake at 125
°
C for 10 hours)
VP15-103-2
Partial heating
Pin temperature: 300
°
C Max., Time: 3 sec. Max. (per pin row)
–
Note
After opening the dry pack, store is at 25
°
C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating for pins).
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