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參數(shù)資料
| 型號： | UPD75306BGK |
| 廠商： | NEC Corp. |
| 英文描述： | 4-BIT SINGLE-CHIP MICROCOMPUTER |
| 中文描述： | 4位單片機 |
| 文件頁數(shù)： | 67/76頁 |
| 文件大?。?/td> | 572K |
| 代理商： | UPD75306BGK |
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μ
PD75304B,75306B,75308B
67
13. RECOMMENDED SOLDERING CONDITIONS
These products should be soldered and mounted under the conditions recommended below.
For details of recommended soldering conditions, refer to the information document
"Surface Mount
Technology Manual (IEI 1207)"
.
For soldering methods and conditions other than those recommended, please contact our salesman.
Table 13-1 Surface Mount Type Soldering Conditions
#
(1)
μ
PD75304BGC-
×××
-3B9: 80-Pin Plastic QFP (
I
I
14 mm)
μ
PD75306BGC-
×××
-3B9: 80-Pin Plastic QFP (
I
I
14 mm)
μ
PD75308BGC-
×××
-3B9: 80-Pin Plastic QFP (
I
I
14 mm)
Soldering Method
Soldering ConditionsRecommended
Condition Symbol
Package peak temperature: 230
°
C Duration: 30 sec. max. (210
°
C or above)
Number of applications: one
Time limit: 7 days
*
(thereafter 20 hours 125
°
C prebaking required)
Infrared reflow
Package peak temperature: 215
°
C Duration: 40 sec. max. (200
°
C or above)
Number of applications: one
Time limit: 7 days* (thereafter 20 hours 125
°
C prebaking required)
VPS
Pin part heating
Pin part temperature: 300
°
C or less
Duration: 3 sec. max. (per side of device)
IR30-207-1
VP15-207-1
*
For the storage period after dry-pack decapsulation, storage conditions are max. 25
°
C, 65% RH.
Note
Use of more than one soldering method should be avoided (except in the case of pin part heating).
IR30-00-1
VP15-00-1
WS60-00-1
Soldering Method
Soldering ConditionsRecommended
Condition Symbol
Infrared reflow
Package peak temperature: 230
°
C Duration: 30 sec. max. (210
°
C or above)
Number of applications: one
VPS
Package peak temperature: 215
°
C Duration: 40 sec. max. (200
°
C or above)
Number of applications: one
Solder bath temperature: 260
°
C or less Duration: 10 sec. max.
Number of applications: one
Preparatory heating temperature: 120
°
C max. (package surface temperature)
Wave soldering
Pin part heating
Pin part temperature: 300
°
C or less
Duration: 3 sec. max. (per side of device)
(2)
μ
PD75304BGF-
×××
-3B9: 80-Pin Plastic QFP (14
×
20 mm)
μ
PD75306BGF-
×××
-3B9: 80-Pin Plastic QFP (14
×
20 mm)
μ
PD75308BGF-
×××
-3B9: 80-Pin Plastic QFP (14
×
20 mm)
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