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參數資料
| 型號： | UPD753017AGC |
| 廠商： | NEC Corp. |
| 元件分類： | 4位微控制器 |
| 英文描述： | 4-BIT SINGLE-CHIP MICROCONTROLLER FOR SMALL GENERAL-PURPOSE INFRARED REMOTE CONTROL TRANSMITTER |
| 中文描述： | 4位單片機的小型通用紅外遙控器 |
| 文件頁數： | 77/88頁 |
| 文件大?。?/td> | 438K |
| 代理商： | UPD753017AGC |
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77
μ
PD753012A, 753016A, 753017A
Data Sheet U11662EJ2V0DS00
15. RECOMMENDED SOLDERING CONDITIONS
Solder the
μ
PD753017A under the following recommended conditions.
For the details on the recommended soldering conditions, refer to Information Document
Semiconductor
Device Mounting Technology Manual (C10535E)
.
For the soldering methods and conditions other than those recommended, consult NEC.
Table 15-1. Soldering Conditions of Surface Mount Type (1/2)
(1)
μ
PD753012AGC-XXX-3B9: 80-pin plastic QFP (14
×
14 mm, resin thickness 2.7 mm)
μ
PD753016AGC-XXX-3B9: 80-pin plastic QFP (14
×
14 mm, resin thickness 2.7 mm)
μ
PD753017AGC-XXX-3B9: 80-pin plastic QFP (14
×
14 mm, resin thickness 2.7 mm)
Soldering Method
Soldering Conditions
Symbol
Infrared reflow
Package peak temperature: 235
°
C, Reflow time: 30 seconds or below
(210
°
C or higher), Number of reflow processes: 3 max.
Package peak temperature: 215
°
C, Reflow time: 40 seconds or below
(200
°
C or higher), Number of reflow processes: 3 max.
Solder temperature: 260
°
C or below, Time: 10 seconds or below,
Number of flow processes: 1
Preheating temperature: 120
°
C or below (package surface temperature)
Pin temperature: 300
°
C or below, Time: 3 seconds or below
(per side of device)
IR35-00-3
VPS
VP15-00-3
Wave soldering
WS60-00-1
Partial heating
–
(2)
μ
PD753012AGC-XXX-8BT: 80-pin plastic QFP (14
×
14 mm, resin thickness 1.4 mm)
μ
PD753016AGC-XXX-8BT: 80-pin plastic QFP (14
×
14 mm, resin thickness 1.4 mm)
μ
PD753017AGC-XXX-8BT: 80-pin plastic QFP (14
×
14 mm, resin thickness 1.4 mm)
Soldering Method
Soldering Conditions
Symbol
Infrared reflow
Package peak temperature: 235
°
C, Reflow time: 30 seconds or below
(210
°
C or higher), Number of reflow processes: 2 max.
Package peak temperature: 215
°
C, Reflow time: 40 seconds or below
(200
°
C or higher), Number of reflow processes: 2 max.
Solder temperature: 260
°
C or below, Time: 10 seconds or below,
Number of flow processes: 1
Preheating temperature: 120
°
C or below (package surface temperature)
Pin temperature: 300
°
C or below, Time: 3 seconds or below
(per side of device)
IR35-00-2
VPS
VP15-00-2
Wave soldering
WS60-00-1
Partial heating
–
Caution Do not use two or more soldering methods in combination (except the partial heating method).
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