參數(shù)資料
型號(hào)： UPD70F3025AGC-25-8EU
廠商： NEC Corp.
英文描述： V853TM 32-/16-BIT SINGLE-CHIP MICROCONTROLLER
中文描述： V853TM 32-/16-BIT單片機(jī)
文件頁數(shù)： 38/44頁
文件大?。?/td> 295K
代理商： UPD70F3025AGC-25-8EU
μ
PD70F3003A, 70F3025A
38
Data Sheet U13189EJ3V0DS00
5. RECOMMENDED SOLDERING CONDITIONS
Solder this product under the following recommended conditions.
For details of the recommended soldering conditions, refer to information document
Semiconductor Device
Mounting Technology Manual (C10535E)
.
For soldering methods and conditions other than those recommended, consult NEC.
Table 5-1. Soldering Conditions
μ
PD70F3003AGC-25-8EU : 100-pin plastic LQFP (fine pitch) (14
×
14 mm)
μ
PD70F3003AGC-33-8EU : 100-pin plastic LQFP (fine pitch) (14
×
14 mm)
μ
PD70F3025AGC-25-8EU : 100-pin plastic LQFP (fine pitch) (14
×
14 mm)
μ
PD70F3025AGC-33-8EU : 100-pin plastic LQFP (fine pitch) (14
×
14 mm)
Soldering Method
Soldering Condition
Symbol of Recommended
Soldering Condition
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 seconds max.
(210
°
C min.), Number of times: 3 max., Number of days:
3
Note
(after that, prebaking is necessary at 125
°
C
for 10 hours.)
IR35-103-3
VPS
Package peak temperature: 215
°
C, Time: 40 seconds max.
(200
°
C min.), Number of times: 3 max., Number of days:
3
Note
(after that, prebaking is necessary at 125
°
C
for 10 hours.)
VP15-103-3
Partial heating
Pin temperature: 300
°
C max., Time: 3 seconds max. (per
side of device)
—
Note
The number of days for storage at 25
°
C, 65% RH MAX after the dry pack has been opened.
Caution
Do not use two or more soldering methods in combination (except partial heating method).
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
UPD70F3025AGC-33-8EU 制造商:NEC 制造商全稱:NEC 功能描述:V853TM 32-/16-BIT SINGLE-CHIP MICROCONTROLLER
UPD70F3025AGC-33-8EU-A 功能描述:MCU 32BIT 256K FLASH 100LQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:V853 產(chǎn)品培訓(xùn)模塊:CAN Basics Part-1 CAN Basics Part-2 Electromagnetic Noise Reduction Techniques Part 1 M16C Product Overview Part 1 M16C Product Overview Part 2 標(biāo)準(zhǔn)包裝:1 系列:M16C™ M32C/80/87 核心處理器:M32C/80 芯體尺寸:16/32-位 速度:32MHz 連通性:EBI/EMI，I²C，IEBus，IrDA，SIO，UART/USART 外圍設(shè)備:DMA，POR，PWM，WDT 輸入/輸出數(shù):121 程序存儲(chǔ)器容量:384KB（384K x 8） 程序存儲(chǔ)器類型:閃存 EEPROM 大小:- RAM 容量:24K x 8 電壓 - 電源 (Vcc/Vdd):3 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 34x10b，D/A 2x8b 振蕩器型:內(nèi)部 工作溫度:-20°C ~ 85°C 封裝/外殼:144-LQFP 包裝:托盤 產(chǎn)品目錄頁面:749 (CN2011-ZH PDF) 配用:R0K330879S001BE-ND - KIT DEV RSK M32C/87
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