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參數(shù)資料
| 型號： | UPD703031AYGC |
| 廠商： | NEC Corp. |
| 英文描述： | V850/SB1TM 32-/16-BIT SINGLE-CHIP MICROCONTROLLERS |
| 中文描述： | V850/SB1TM 32-/16-BIT單晶片微控制器 |
| 文件頁數(shù)： | 50/56頁 |
| 文件大小： | 357K |
| 代理商： | UPD703031AYGC |
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Data Sheet U14734EJ1V0DS00
50
μ
PD703031A, 703031AY, 703033A, 703033AY, 70F3033A, 70F3033AY
6. RECOMMENDED SOLDERING CONDITIONS
The
μ
PD703031A, 703031AY, 703033A, 703033AY, 70F3033A, and 70F3033AY should be soldered and mounted
under the following recommended conditions.
For the details of the recommended soldering conditions, refer to the document
Semiconductor Device Mounting
Technology Manual (C10535E).
For soldering methods and conditions other than those recommended below, contact your NEC sales
representative.
Table 6-1. Surface Mounting Type Soldering Conditions (1/2)
(1)
μ
PD703031AGC-
μ
PD703031AYGC-
μ
PD703033AGC-
μ
PD703033AYGC-
×××
-8EU: 100-pin plastic LQFP (fine pitch) (14
×
14)
×××
-8EU: 100-pin plastic LQFP (fine pitch) (14
×
14)
×××
-8EU: 100-pin plastic LQFP (fine pitch) (14
×
14)
×××
-8EU: 100-pin plastic LQFP (fine pitch) (14
×
14)
Soldering Method
Soldering Conditions
Recommended
Condition
Symbol
Infrared reflow
Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),
Count: Two times or less
Exposure limit: 7 days
Note
(after that, prebake at 125°C for 10 hours)
IR35-107-2
VPS
Package peak temperature: 215°C, Time: 40 seconds max. (at 200°C or higher),
Count: Two times or less
Exposure limit: 7 days
Note
(after that, prebake at 125°C for 10 hours)
VP15-107-2
Partial heating
Pin temperature: 300°C max., Time: 3 seconds max. (per pin row)
–
Note
After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution
Do not use different soldering methods together (except for partial heating).
(2)
μ
PD70F3033AGC-8EU:
μ
PD70F3033AYGC-8EU:
100-pin plastic LQFP (fine pitch) (14
×
14)
100-pin plastic LQFP (fine pitch) (14
×
14)
Soldering Method
Soldering Conditions
Recommended
Condition
Symbol
Infrared reflow
Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),
Count: Two times or less
Exposure limit: 3 days
Note
(after that, prebake at 125°C for 10 hours)
IR35-103-2
VPS
Package peak temperature: 215°C, Time: 40 seconds max. (at 200°C or higher),
Count: Two times or less
Exposure limit: 3 days
Note
(after that, prebake at 125°C for 10 hours)
VP15-103-2
Partial heating
Pin temperature: 300°C max., Time: 3 seconds max. (per pin row)
–
Note
After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution
Do not use different soldering methods together (except for partial heating).
相關PDF資料 |
PDF描述 |
|---|---|
| UPD703033AYGC | V850/SB1TM 32-/16-BIT SINGLE-CHIP MICROCONTROLLERS |
| UPD70F3033A | V850/SB1TM 32-/16-BIT SINGLE-CHIP MICROCONTROLLERS |
| UPD70F3033AGC-8EU | V850/SB1TM 32-/16-BIT SINGLE-CHIP MICROCONTROLLERS |
| UPD70F3033AY | V850/SB1TM 32-/16-BIT SINGLE-CHIP MICROCONTROLLERS |
| UPD703031A | V850/SB1TM 32-/16-BIT SINGLE-CHIP MICROCONTROLLERS |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| UPD703031AYGF | 制造商:NEC 制造商全稱:NEC 功能描述:V850/SB1TM 32-/16-BIT SINGLE-CHIP MICROCONTROLLERS |
| UPD703031B | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:V850/SB1(TM).V850/SB2(TM) for Hardware | UM Including Electrical Characteristics[02/2003] |
| UPD703031BY | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:V850 Series Pamphlet | Pamphlet[02/2002] |
| UPD703032A | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:V850/SB1(TM).V850/SB2(TM) for Hardware | UM Including Electrical Characteristics[02/2003] |
| UPD703032AY | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:V850 Family(TM) for Architecture | User＇s Manual[03/2001] |
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