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參數(shù)資料
| 型號： | UPD4704 |
| 廠商： | NEC Corp. |
| 元件分類： | 通用總線功能 |
| 英文描述： | EXTENSION 8-BIT UP/DOWN COUNTER CMOS INTEGRATED CIRCUITS |
| 中文描述： | 延展8位加/減計(jì)數(shù)器CMOS集成電路 |
| 文件頁數(shù)： | 11/16頁 |
| 文件大小： | 191K |
| 代理商： | UPD4704 |
11
μ
PD4704
RECOMMENDED SOLDERING CONDITIONS
The following conditions (see table below) must be met when soldering this product.
Please consult with our sales offices in case other soldering process is used, or in case soldering is done under
different conditions.
TYPES OF SURFACE MOUNT DEVICE
For more details, refer to our document
“Semiconductor Device Mounting Technology Manual” (IEI-1207)
.
μ
PD4704G
Soldering process
Soldering conditions
Symbol
Infrared ray reflow
Peak package’s surface temperature: 235
°
C or below,
Reflow time: 30 seconds or below (210
°
C or higher),
Number of reflow process: 2, Exposure limit
*
: None
IR35-00-2
VPS
Peak package’s surface temperature: 215
°
C or below,
Reflow time: 40 seconds or below (200
°
C or higher),
Number of reflow process: 2, Exposure limit
*
: None
VP15-00-2
Wave soldering
Solder temperature: 260
°
C or below,
Flow time: 10 seconds or below,
Number of flow process: 1, Exposure limit
*
: None
WS60-00-1
Partial heating method
Terminal temperature: 300
°
C or below,
Flow time: 10 seconds or below,
Exposure limit
*
: None
G
G
*
Exposure limit before soldering after dry-pack package is opened.
Storage conditions: 25
°
C and relative humidity at 65 % or less.
Note
Do not apply more than a single process at once, except for “Partial heating method”.
TYPES OF THROUGH HOLE MOUNT DEVICE
μ
PD4704C
Soldering process
Soldering conditions
Symbol
Wave soldering
Solder temperature: 260
°
C or below,
Flow time: 10 seconds or below
REFERENCE
Dcodument name
Document No.
NEC semiconductor device reliability/quality control system
IEI-1212
Quality grade on NEC semiconductor devices
IEI-1209
Semiconductor device mounting technology manual
IEI-1207
Semiconductor device package manual
IEI-1213
Guide to quality assurance for semiconductor devices
MEI-1202
Semiconductor selection guide
MF-1134
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| UPD4704C | EXTENSION 8-BIT UP/DOWN COUNTER CMOS INTEGRATED CIRCUITS |
| UPD4704G | EXTENSION 8-BIT UP/DOWN COUNTER CMOS INTEGRATED CIRCUITS |
| UPD4712D | Low Power 5V RS232 Dual Driver/Receiver with 0.1?μF Capacitors; Package: SO; No of Pins: 16; Temperature Range: -40?°C to 85?°C |
| UPD4712DCY | Low Power 5V RS232 Dual Driver/Receiver with 0.1?μF Capacitors; Package: SO; No of Pins: 16; Temperature Range: -40?°C to 85?°C |
| UPD4712DGT | Low Power 5V RS232 Dual Driver/Receiver with 0.1?μF Capacitors; Package: SO; No of Pins: 16; Temperature Range: -40?°C to 85?°C |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| uPD4704C(A) | 制造商:Renesas Electronics 功能描述:Cut Tape |
| UPD4711AGS | 制造商:Panasonic Industrial Company 功能描述:IC |
| UPD4711BGS | 制造商:Panasonic Industrial Company 功能描述:IC |
| UPD4712ACY | 制造商:Panasonic Industrial Company 功能描述:IC SUBBING WITH UPD4712CCY |
| UPD4712CCY | 制造商:Panasonic Industrial Company 功能描述:IC |
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