參數(shù)資料
型號： UPD178024GC
廠商： NEC Corp.
元件分類： 8位微控制器
英文描述： 8-bit Microcontroller with 2/4/8K Bytes In-System Programmable Flash
中文描述： 8位微控制器與2/4/8K字節(jié)在系統(tǒng)可編程閃存
文件頁數(shù)： 94/98頁
文件大?。?/td> 467K
代理商： UPD178024GC
Data Sheet U14608EJ1V0DS00
94
μ
PD178024GC-051
15. RECOMMENDED SOLDERING CONDITIONS
The
μ
PD178024GC-051 should be soldered and mounted under the following recommended conditions.
For the details of the recommended soldering conditions, refer to the document
Semiconductor Device
Mounting Technology Manual (C10535E)
.
For soldering methods and conditions other than those recommended below, consult your NEC sales
representative.
Table 10-1. Surface Mounting Type Soldering Conditions
μ
PD178024GC-051-8BT: 80-pin plastic QFP (14
×
14 mm, 0.65 mm pitch)
Soldering Method
Soldering Conditions
Recommended
Conditions Symbol
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 seconds max. (at 210
°
C
or higher), Count: two times or less
IR35-00-2
VPS
Package peak temperature: 215
°
C, Time: 40 seconds max. (at 200
°
C
or higher), Count: two times or less
VP15-00-2
Wave soldering
Solder bath temperature: 260
°
C max., Time: 10 seconds max.,
Count: once, Preheating temperature: 120
°
C max.,
(Package surface temperature)
WS60-00-1
Partial heating
Pin temperature: 300
°
C max., Time: 3 seconds max. (per pin row)
Caution Do not use different soldering methods together (except partial heating).
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