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參數(shù)資料
| 型號： | UPC4741C(5) |
| 英文描述： | OP-AMP|QUAD|BIPOLAR|DIP|14PIN|PLASTIC |
| 中文描述： | 運放|四|雙極|雙酯| 14PIN |塑料 |
| 文件頁數(shù)： | 9/12頁 |
| 文件大?。?/td> | 69K |
| 代理商： | UPC4741C(5) |
Data Sheet G16051EJ3V0DS
9
μ
PC4741
RECOMMENDED SOLDERING CONDITIONS
When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering
processes are used, or if the soldering is performed under different conditions, please make sure to consult with our sales
offices.
For more details, refer to below our document "
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY
MANUAL"(C10535E)
.
Type of Surface Mount Device
μ
PC4741G2, 4741G2(5): 14-pin plastic SOP (5.72 mm (225))
Process
Conditions
Symbol
Infrared Ray Reflow
Peak temperature: 235°C or below (Package surface temperature),
Reflow time: 30 seconds or less (at 210°C or higher),
Maximum number of reflow processes: 3 time.
IR35-00-3
Vapor Phase Soldering
Peak temperature: 215°C or below (Package surface temperature),
Reflow time: 40 seconds or less (at 200°C or higher),
Maximum number of reflow processes: 3 time.
VP15-00-3
Wave Soldering
Solder temperature: 260°C or below, Flow time: 10 seconds or less,
Maximum number of flow processes: 1 time,
Pre-heating temperature: 120°C or below (Package surface temperature).
WS60-00-1
Partial Heating Method
Pin temperature: 300°C or below,
Heat time: 3 seconds or less (Per each side of the device).
–
Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the
device will be damaged by heat stress.
Type of Through-hole Device
μ
PC4741C, 4741C(5): 14-pin plastic DIP (7.62 mm (300))
Process
Conditions
Wave Soldering
(only to leads)
Solder temperature: 260°C or below,
Flow time: 10 seconds or less.
Partial Heating Method
Pin temperature: 300°C or below,
Heat time: 3 seconds or less (per each lead).
Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure that
the package body does not get jet soldered.
#
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