- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄382720 > UDA1334BT (NXP SEMICONDUCTORS) Low power audio DAC PDF資料下載
參數(shù)資料
| 型號(hào)： | UDA1334BT |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | DAC |
| 英文描述： | Low power audio DAC |
| 中文描述： | SERIAL INPUT LOADING, 24-BIT DAC, PDSO16 |
| 封裝： | 3.90 MM, PLASTIC, MS-012, SOT-109-1, SOP-16 |
| 文件頁(yè)數(shù)： | 19/24頁(yè) |
| 文件大小： | 108K |
| 代理商： | UDA1334BT |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)當(dāng)前第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)
2002 May 22
19
Philips Semiconductors
Product specification
Low power audio DAC
UDA1334BT
17.5
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
For more detailed information on the BGA packages refer to the“(LF)BGA Application Note” (AN01026); order a copy
from your Philips Semiconductors sales office.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
6.
PACKAGE
(1)
SOLDERING METHOD
WAVE
REFLOW
(2)
BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA
HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN,
HVSON, SMS
PLCC
(4)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
not suitable
not suitable
(3)
suitable
suitable
suitable
not recommended
(4)(5)
not recommended
(6)
suitable
suitable
suitable
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| UDA1334TS | Low power audio DAC |
| UDA1335H | Universal Serial Bus USB Audio Playback Recording Peripheral APRP |
| UDA1340 | Low-voltage low-power stereo audio CODEC with DSP features |
| UDA1340M | Low-voltage low-power stereo audio CODEC with DSP features |
| UDA1342 | Audio CODEC |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| UDA1334BT/N2 | 制造商:NXP Semiconductors 功能描述:IC DAC AUDIO LP 16-SOIC |
| UDA1334BT/N2,112 | 功能描述:數(shù)模轉(zhuǎn)換器- DAC LOW POWER AUDIO DAC RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時(shí)間:1 us 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube |
| UDA1334BT/N2,118 | 功能描述:音頻數(shù)/模轉(zhuǎn)換器 IC LOW POWER AUDIO DAC RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量: 分辨率:16 bit 接口類型:I2S, UBS 轉(zhuǎn)換速率: 信噪比:98 dB 工作電源電壓:5 V DAC 輸出端數(shù)量:2 工作溫度范圍:- 25 C to + 85 C 電源電流:23 mA 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-32 封裝:Reel |
| UDA1334BTD | 功能描述:數(shù)模轉(zhuǎn)換器- DAC LOW POWER AUDIO DAC RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時(shí)間:1 us 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube |
| UDA1334BTS | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Low power audio DAC |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。