參數(shù)資料
型號: UCC27200_07
廠商: Texas Instruments, Inc.
英文描述: 120-V Boot, 3-A Peak, High Frequency, High-Side/Low-Side Driver
中文描述: 120伏啟動,3 - A峰,高頻率,低階驅(qū)動
文件頁數(shù): 3/31頁
文件大?。?/td> 909K
代理商: UCC27200_07
www.ti.com
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
ELECTROSTATIC DISCHARGE (ESD) PROTECTION
THERMAL CHARACTERISTICS
over operating free-air temperature range, maximum power dissipation at ambient temperature: P
DISS
= (150-T
A
) /
θ
JA
,
(unless otherwise noted)
UCC27200, UCC27201
SLUS746–DECEMBER 2006
PARAMETER
MIN
NOM
MAX
UNIT
V
DD
V
HS
Supply voltage range
Voltage on HS
Voltage on HS, (repetitive pulse <100 ns)
8
12
17
-1
-5
105
110
V
V
HB
V
HS
+ 8,
V
DD
–1
V
HS
+ 17,
Voltage on HB
115
50
+140
Voltage slew rate on HS
Operating junction temperature range
V / ns
°C
T
J
-40
METHOD
MIN
2000
1000
UNIT
Human body model
CDM
V
θ
JA
(
°
C/W)(Junction to
Ambient)
95
46
38
θ
JP
(
°
C/W) ( Junction to
PowerPad)
NA
4.8
4.1
PACKAGE
θ
JC
(
°
C/W)( Junction to Case)
D
71
71
56
DDA
(1)
DRM
(2)
(1)
Test board conditions:
3in x 3in, four4 layers, thickness: 0.062 in.
2-oz copper traces located on the top and bottom of the PCB.
2-oz copper ground planes on the internal 2 layers.
Six thermal vias in the PowerPad area under the device package.
Test board conditions:
3in x 3in, 4 layers, thickness: 0.062 in.
2-oz copper traces located on the top and bottom of the PCB.
2-oz copper ground planes on the internal 2 layers.
Four thermal vias in the PowerPad area under the device package.
(2)
3
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