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參數(shù)資料
| 型號(hào)： | UCB1400BE |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 消費(fèi)家電 |
| 英文描述： | Audio codec with touch screen controller and power management monitor |
| 中文描述： | SPECIALTY CONSUMER CIRCUIT, PQFP48 |
| 封裝： | 7 X 7 X 1.40 MM, PLASTIC, LQFP-48 |
| 文件頁數(shù)： | 60/63頁 |
| 文件大?。?/td> | 674K |
| 代理商： | UCB1400BE |
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Philips Semiconductors
UCB1400
Audio codec with touch screen controller
and power management monitor
Product data
Rev. 02 — 21 June 2002
60 of 63
9397 750 09611
Koninklijke Philips Electronics N.V. 2002. All rights reserved.
During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time is 4 seconds at 250
°
C. A mildly-activated flux will eliminate the
need for removal of corrosive residues in most applications.
20.4 Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low
voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time
must be limited to 10 seconds at up to 300
°
C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 to 5 seconds between 270 and 320
°
C.
20.5 Package related soldering information
[1]
For more detailed information on the BGA packages refer to the (LF)BGA Application Note
(AN01026); order a copy from your Philips Semiconductors sales office.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal
or external package cracks may occur due to vaporization of the moisture in them (the so called
popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated
Circuit Packages; Section: Packing Methods
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[2]
[3]
[4]
[5]
[6]
Table 62:
Suitability of surface mount IC packages for wave and reflow soldering
methods
Soldering method
Wave
BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA
HBCC, HBGA, HLQFP, HSQFP, HSOP,
HTQFP, HTSSOP, HVQFN, HVSON, SMS
PLCC
[4]
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
Package
[1]
Reflow
[2]
suitable
suitable
not suitable
not suitable
[3]
suitable
not recommended
[4][5]
not recommended
[6]
suitable
suitable
suitable
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| UCB1400BE,128 | 功能描述:接口—CODEC AUDIO CODEC WITH TOUCHSCREEN RoHS:否 制造商:Texas Instruments 類型: 分辨率: 轉(zhuǎn)換速率:48 kSPs 接口類型:I2C ADC 數(shù)量:2 DAC 數(shù)量:4 工作電源電壓:1.8 V, 2.1 V, 2.3 V to 5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DSBGA-81 封裝:Reel |
| UCB1400BE,151 | 功能描述:接口—CODEC AUDIO CODEC RoHS:否 制造商:Texas Instruments 類型: 分辨率: 轉(zhuǎn)換速率:48 kSPs 接口類型:I2C ADC 數(shù)量:2 DAC 數(shù)量:4 工作電源電壓:1.8 V, 2.1 V, 2.3 V to 5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DSBGA-81 封裝:Reel |
| UCB1400BE,157 | 功能描述:接口—CODEC DO NOT USE ORDER -S OR -T PART RoHS:否 制造商:Texas Instruments 類型: 分辨率: 轉(zhuǎn)換速率:48 kSPs 接口類型:I2C ADC 數(shù)量:2 DAC 數(shù)量:4 工作電源電壓:1.8 V, 2.1 V, 2.3 V to 5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DSBGA-81 封裝:Reel |
| UCB1400BEFE | 功能描述:IC AUDIO CODEC W/TCH SCRN 48LQFP RoHS:是 類別:集成電路 (IC) >> 接口 - 編解碼器 系列:- 標(biāo)準(zhǔn)包裝:2,500 系列:- 類型:立體聲音頻 數(shù)據(jù)接口:串行 分辨率（位）:18 b ADC / DAC 數(shù)量:2 / 2 三角積分調(diào)變:是 S/N 比，標(biāo)準(zhǔn) ADC / DAC (db):81.5 / 88 動(dòng)態(tài)范圍，標(biāo)準(zhǔn) ADC / DAC (db):82 / 87.5 電壓 - 電源，模擬:2.6 V ~ 3.3 V 電壓 - 電源，數(shù)字:1.7 V ~ 3.3 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:48-WFQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:48-TQFN-EP（7x7） 包裝:帶卷 (TR) |
| UCB1400BE-S | 功能描述:接口—CODEC AUDIO CODEC NO NEW DESIGNS RoHS:否 制造商:Texas Instruments 類型: 分辨率: 轉(zhuǎn)換速率:48 kSPs 接口類型:I2C ADC 數(shù)量:2 DAC 數(shù)量:4 工作電源電壓:1.8 V, 2.1 V, 2.3 V to 5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DSBGA-81 封裝:Reel |
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