- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄381146 > UC1608xFAC (Electronic Theatre Controls, Inc.) 128COM x 240SEG Matrix LCD Controller-Driver PDF資料下載
參數(shù)資料
| 型號： | UC1608xFAC |
| 廠商： | Electronic Theatre Controls, Inc. |
| 英文描述： | 128COM x 240SEG Matrix LCD Controller-Driver |
| 中文描述： | 128COM x 240SEG矩陣LCD控制器驅(qū)動器 |
| 文件頁數(shù)： | 5/42頁 |
| 文件大?。?/td> | 996K |
| 代理商： | UC1608XFAC |
第1頁第2頁第3頁第4頁當(dāng)前第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁
U
LTRA
C
HIP
High-Voltage Mixed-Signal IC
1999-2002
2
Revision 0.52
O
RDERING
I
NFORMATION
Product ID
Description
UC1608xGAC
Gold bumped die.
UC1608xFAC
COF packaging.
General Notes
A
PPLICATION
I
NFORMATION
For improved readability, the specification contains many application data points. When application information is given, it
is advisory and does not form part of the specification for the device.
B
ARE
D
IE
D
ISCLAIMER
All die are tested and are guaranteed to comply with all data sheet limits up to the point of wafer sawing for a period of
ninety (90) days from the date of UltraChip’s delivery. There is no post waffle saw/pack testing performed on individual die.
Although the latest modern processes are utilized for wafer sawing and die pick-&-place into waffle pack carriers,
UltraChip has no control of third party procedures in the handling, packing or assembly of the die. Accordingly, it is the
responsibility of the customer to test and quality their application in which the die is to be used. UltraChip assumes no
liability for device functionality or performance of the die or systems after handling, packing or assembly of the die.
L
IFE
S
UPPORT
A
PPLICATIONS
These devices are not designed for use in life support appliances, or systems where malfunction of these products can
reasonably be expected to result in personal injuries. Customer using or selling these products for use in such
applications do so at their own risk.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| UC1608xGAC | 128COM x 240SEG Matrix LCD Controller-Driver |
| UC1682 | HIGH-VOLTAGE MIXED-SIGNAL IC |
| UC1682TFBZ | HIGH-VOLTAGE MIXED-SIGNAL IC |
| UC1682THCZ | HIGH-VOLTAGE MIXED-SIGNAL IC |
| UC1682XFBZ | HIGH-VOLTAGE MIXED-SIGNAL IC |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| UC1608XGAC | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:128COM x 240SEG Matrix LCD Controller-Driver |
| UC1610 | 制造商:TI 制造商全稱:Texas Instruments 功能描述:Dual Schottky Diode Bridge |
| UC1610 DIE | 制造商:Texas Instruments 功能描述: |
| UC1610_12 | 制造商:TI 制造商全稱:Texas Instruments 功能描述:DUAL SCHOTTKY DIODE BRIDGE |
| UC1610DW | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:BRIDGE/RING DIODE ARRAY|SO |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。