參數(shù)資料
型號: TZA3031AHL
廠商: NXP SEMICONDUCTORS
元件分類: 其它接口
英文描述: SDH/SONET STM1/OC3 laser drivers(SDH/SONET STM1/OC3 激光驅(qū)動器)
中文描述: SPECIALTY INTERFACE CIRCUIT, PQFP32
封裝: 5 X 5 X 1.40 MM, PLASTIC, LQFP-32
文件頁數(shù): 24/32頁
文件大?。?/td> 137K
代理商: TZA3031AHL
2000 Feb 22
24
Philips Semiconductors
Product specification
SDH/SONET STM1/OC3 laser drivers
TZA3031AHL; TZA3031BHL;
TZA3031U
handbook, full pagewidth
MBK849
2 mm
(1)
0
0
TZA3031U
2 mm
(1)
T
I
G
M
G
G
V
V
B
T
A
Z
G
O
LAQ
VCC(B)
VCC(B)
GND
ALS
GND
GND
LA
GND
BIAS
GND
GND
GND
ENL
ALARM
GND
VCC(R)
DINQ
DIN
VCC(R)
G
A
V
D
D
V
x
y
1
2
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
3
40
39
38
37
36
35
34
33
32
31
4
Fig.20 Bonding pad locations of TZA3031U.
(1) Typical value.
Table 1
Physical characteristics of bare die
PARAMETER
VALUE
Glass passivation
Bonding pad dimension
Metallization
Thickness
Size
Backing
Attach temperature
Attach time
2.1
μ
m PSG (PhosphoSilicate Glass) on top of 0.7
μ
m silicon nitride
minimum dimension of exposed metallization is 90
×
90
μ
m (pad size = 100
×
100
μ
m)
1.2
μ
m AlCu (1% Cu)
380
μ
m nominal
2.000
×
2.000 mm (4.000 mm
2
)
silicon; electrically connected to GND potential through substrate contacts
<430
°
C; glue is recommended for attaching die
<15 s
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