參數(shù)資料
型號： TZA1035HL
廠商： NXP SEMICONDUCTORS
元件分類： 消費(fèi)家電
英文描述： High speed advanced analog DVD signal processor and laser supply
中文描述： SPECIALTY CONSUMER CIRCUIT, PQFP48
封裝： 7 X 7 MM, 1.40 MM HEIGHT, PLASTIC, SOT-313-2, MS-026, LQFP-48
文件頁數(shù)： 43/48頁
文件大小： 199K
代理商： TZA1035HL
2003 Jun 03
43
Philips Semiconductors
Preliminary specification
High speed advanced analog DVD signal
processor and laser supply
TZA1035HL
13.5
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
For more detailed information on the BGA packages refer to the“(LF)BGA Application Note” (AN01026); order a copy
from your Philips Semiconductors sales office.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account
be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature
exceeding 217
°
C
±
10
°
C measured in the atmosphere of the reflow oven. The package body peak temperature
must be kept as low as possible.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
6.
7.
PACKAGE
(1)
SOLDERING METHOD
WAVE
REFLOW
(2)
BGA, LBGA, LFBGA, SQFP, SSOP-T
(3)
, TFBGA, VFBGA
DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP,
HTSSOP, HVQFN, HVSON, SMS
PLCC
(5)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO, VSSOP
not suitable
not suitable
(4)
suitable
suitable
suitable
not recommended
(5)(6)
not recommended
(7)
suitable
suitable
suitable
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相關(guān)代理商/技術(shù)參數(shù)
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TZA1036HL/M1A,118 功能描述:IC DVD/CD PLAYBACK 208LQFP RoHS:是 類別:集成電路 (IC) >> 專用 IC 系列:* 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:1 系列:- 類型:調(diào)幀器 應(yīng)用:數(shù)據(jù)傳輸 安裝類型:表面貼裝 封裝/外殼:400-BBGA 供應(yīng)商設(shè)備封裝:400-PBGA（27x27） 包裝:散裝
TZA1038HW 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:High speed advanced analog DVD signal processor and laser supply
TZA1038HW,118 功能描述:音頻 DSP DVDALASLITE AUTO RoHS:否 制造商:Texas Instruments 工作電源電壓: 電源電流: 工作溫度范圍: 安裝風(fēng)格: 封裝 / 箱體: 封裝:Tube
TZA1038HW-T 功能描述:音頻 DSP DVDALASLITE AUTO RoHS:否 制造商:Texas Instruments 工作電源電壓: 電源電流: 工作溫度范圍: 安裝風(fēng)格: 封裝 / 箱體: 封裝:Tube
TZ-A103SS 制造商:Panasonic Industrial Company 功能描述:SIGNAL SENDER
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