參數(shù)資料
型號: TSS461
英文描述: Van Controller Serial Interface
中文描述: 范控制器串行接口
文件頁數(shù): 15/24頁
文件大?。?/td> 215K
代理商: TSS461
Qualpack TSS463 / TSS461C
Rev. 2 – January 1999
15
Lot
Number
Z20569K
Device Type
Test Description
Step
Result
Comment
HMT-65664A
in SO 28 (2)
Thermal Cycles
500c
1000c
500h
1000h
2000h
Level 1
0/45
0/45
0/45
0/45
0/45
0/10
85/85 Humidity
Resistance to Soldeting
Heat
Marking Permanency
-
0/3
HAST after Soldering
Stress (with 5.5v bias)
168h
0/45
Global
All products
Mounting Stress level 1
Elect.
0/255
0 ppm
Climatic Tests
-
0/720
0 %
Notes:
(1)
(2)
(3)
(4)
(5)
SUMITOMO 6300 molding compound
NITTO MP8000 molding compound
Electrical test with Quality program at 25°c, 125°c and -40°c
Performed on molded device opened using acid
No Lifted Ball Bond, breakdown observed on wires (83%) and over the stich (17%)
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