參數(shù)資料
型號: TSM4405P
廠商: Taiwan Semiconductor Co., Ltd.
英文描述: Single P-Channel 1.8V Specified MicroSURF MOSFET
中文描述: 單P溝道MOSFET的1.8指定MicroSURF
文件頁數(shù): 1/6頁
文件大?。?/td> 183K
代理商: TSM4405P
TSM4405P
1-6
2003/10 rev. F
TSM4405P
Single P-Channel 1.8V Specified MicroSURF
TM
MOSFET
V
DS
= - 12V
R
DS (on)
, Vgs @ - 4.5V, Ids @ - 4.9A = 55m
R
DS (on)
, Vgs @ - 2.5V, Ids @ - 4.4A = 70m
R
DS (on)
, Vgs @ - 1.8V, Ids @ - 4.0A = 90m
Description
TSM4405P is new low cost, state of the art MicroSURF
TM
lateral MOSFET process technology in chip scale bondwireless
packaging minimizes PCB space and Rds(on) plus provides an ultra low Qg x Rds(on) figure of merit.
Features
Low profile package: less than 0.8mm height when
mounted on PCB
Occupies only 1.21mm
2
of PCB area
Block Diagram
Less than 30% of the area of a SC-70
Excellent thermal and electrical capabilities
Lead free solder bumps available
Ordering Information
Part No.
Packing
Tape & Reel
Q’ty
TSM4405P
3kpcs / 7”
Absolute Maximum Rating
(Ta = 25
o
C
unless otherwise noted)
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
V
DS
- 12V
V
Gate-Source Voltage
V
GS
± 8
V
Continuous Drain Current
I
D
- 4.9
A
Pulsed Drain Current
I
DM
- 10
A
Maximum Power Dissipation (Steady State)
P
D
1. 5
W
Operating Junction Temperature
T
J
+150
o
C
Operating Junction and Storage Temperature Range
T
J
, T
STG
- 55 to +150
o
C
Thermal Performance
Parameter
Symbol
Limit
Unit
Junction to Ambient Thermal Resistance
R
θ
ja
85
o
C/W
Junction to Balls Thermal Resistance
R
θ
jR
20
o
C/W
Lateral Power for
Load Switching and PA Switch
S
S
G
D
Bump Side View
Patent Pending
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