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參數(shù)資料
| 型號： | TSL3301CL |
| 廠商： | AMS-TAOS USA Inc |
| 文件頁數(shù)： | 16/21頁 |
| 文件大小： | 659K |
| 描述： | IC LINEAR SENSOR ARRAY 8CHIPLED |
| 標準包裝： | 1 |
| 系列： | * |
| 其它名稱： | TSL3301-CLDKR |
TSL3301CL
102 ?1 LINEAR OPTICAL SENSOR ARRAY
WITH ANALOG-TO-DIGITAL CONVERTER
TAOS141 JULY 2011
15
The LUMENOLOGY r Company
r
r
Copyright E 2011, TAOS Inc.
www.taosinc.com
PACKAGE INFORMATION
Pb
TOP VIEW
SIDE VIEW
BOTTOM
VIEW
END VIEW
Pin 1
1.0
0.8
2.5
0.95
0.95
0.6
0.6
1.8
7.5 + 0.08
0.22
0.085
(Note B)
8.573 (Note B)
1.2 + 0.2
9.4 + 0.2
Pin 1
3.0 + 0.2
Photodiode Array
(Not to Scale)
C
L
of Package
of Photodiode Array Area (Note C)
C
L
0.37 Nominal
0.011 Nominal
C
L
of Pixel 7 (Note C)
Photodiode Array
(Not to Scale)
C
L
of Solder Contact
NOTES: A. All linear dimensions are in millimeters. Dimension tolerance is ?0.05 mm unless otherwise noted.
B. Nominal photodiode array dimension. The array is made up of 100 inner pixels and 2 end pixels with pixel #1 closer to
Pin 1. The inner pixel is 77 糾 wide by 85 糾 high, spaced on 85糾 centers. The end pixel is 49糾 wide by 132 糾 high.
C. The die is centered within the package within a tolerance of ?0.05 mm.
D. Package top surface is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.56.
E. Contact finish is soft gold plated.
F. This package contains no lead (Pb).
G. This drawing is subject to change without notice.
Figure 8. Package CL Configuration
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